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September 2013

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Subject:
From:
Bob Wettermann <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Bob Wettermann <[log in to unmask]>
Date:
Wed, 4 Sep 2013 11:23:38 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (366 lines)
Gents:

Lyon wrote "Bob,

After removed BGA, we found pad of BGA was missing." From what the patient
is telling us it happened UPON REMOVAL (not during reballing process)

Bob W


On Wed, Sep 4, 2013 at 11:18 AM, Stadem, Richard D. <
[log in to unmask]> wrote:

> I don't think so, as then the other pads would also display varying
> degrees of erosion. This appears to be a pad that was lifted during the
> reballing process, as part of the pad prep after rework (removal of the old
> solder).
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Gumpert, Ben
> Sent: Wednesday, September 04, 2013 9:20 AM
> To: [log in to unmask]
> Subject: Re: [TN] EXTERNAL: [TN] BGA pad drop
>
> Or potentially too much time at liquidus dissolved the pad away, or left
> minimal pad that was easily lifted.
>
> Ben
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
> Sent: Wednesday, September 04, 2013 10:16 AM
> To: [log in to unmask]
> Subject: Re: [TN] EXTERNAL: [TN] BGA pad drop
>
> Well, well, well....there's your answer. I think someone did not have a
> delicate touch when they cleaned the pads...
>
> Steve
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Lyon Yuan
> Sent: Wednesday, September 4, 2013 8:14 AM
> To: [log in to unmask]
> Subject: Re: [TN] EXTERNAL: [TN] BGA pad drop
>
> Hi Steve
>
>
>
> Yes, it was re-balled
>
>
>
> Lyon Yuan
>
>
>
> From: stephen gregory [mailto:[log in to unmask]]
> Sent: Wednesday, September 04, 2013 10:11 PM
> To: Lyon Yuan; TechNet E-Mail Forum
> Subject: Re: [TN] EXTERNAL: [TN] BGA pad drop
>
>
>
> Hi Lyon!
>
>
>
> Have your picture posted, it's here:
>
>
>
> http://stevezeva.homestead.com/Pad_missing.JPG
>
>
>
> Do you know if this BGA was re-balled?
>
>
>
> Steve
>
>
>
> From: Lyon Yuan <[log in to unmask]>
> To: 'stephen gregory' <[log in to unmask]>; 'Steve Gregory'
> <[log in to unmask]>
> Sent: Wednesday, September 4, 2013 8:00 AM
> Subject: RE: [TN] EXTERNAL: [TN] BGA pad drop
>
>
>
> Steve,
>
>
>
> Help to upload picture to web. Thanks
>
>
>
> Lyon Yuan
>
>
>
>
>
> -----Original Message-----
> From: Wenger, George M. [Contractor] [mailto:[log in to unmask]]
> Sent: Wednesday, September 04, 2013 9:54 PM
> To: Lyon Yuan
> Cc: stephen gregory; Steve Gregory
> Subject: RE: [TN] EXTERNAL: [TN] BGA pad drop
>
>
>
> Lyon,
>
>
>
> Attached is a link to his site.  The last emails I had for Steve are on
> the copy to line of this email  <http://stevezeva.homestead.com/>
> http://stevezeva.homestead.com/
>
>
>
>
>
> Regards,
>
> George
>
> George M. Wenger
>
> Failure Signature & Characterization Lab LLC
>
> 609 Cokesbury Road, High Bridge, NJ 08829
>
> (908) 638-8771 Home (732) 309-8964 Mobile
>
> E-mail:  <mailto:[log in to unmask]> [log in to unmask]
>
>  <mailto:[log in to unmask]> [log in to unmask]
>
>
>
>
>
> -----Original Message-----
>
> From: Lyon Yuan [mailto:[log in to unmask]]
>
> Sent: Wednesday, September 04, 2013 9:45 AM
>
> To: Wenger, George M. [Contractor]
>
> Subject: RE: [TN] EXTERNAL: [TN] BGA pad drop
>
>
>
> George
>
>
>
> Thanks, steve's email?
>
>
>
> Lyon Yuan
>
>
>
> -----Original Message-----
>
> From: Wenger, George M. [Contractor] [mailto:[log in to unmask]]
>
> Sent: Wednesday, September 04, 2013 9:35 PM
>
> To: TechNet E-Mail Forum; Lyon Yuan
>
> Subject: RE: [TN] EXTERNAL: [TN] BGA pad drop
>
>
>
> Hi Lyon,
>
>
>
> You might want to send the picture to Steve to post on his site so we all
> can see it.
>
>
>
> Regards,
>
> George
>
> George M. Wenger
>
> Failure Signature & Characterization Lab LLC
>
> 609 Cokesbury Road, High Bridge, NJ 08829
>
> (908) 638-8771 Home (732) 309-8964 Mobile
>
> E-mail:  <mailto:[log in to unmask]> [log in to unmask]
>
>  <mailto:[log in to unmask]> [log in to unmask]
>
>
>
>
>
> -----Original Message-----
>
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Lyon Yuan
>
> Sent: Wednesday, September 04, 2013 9:32 AM
>
> To: [log in to unmask]
>
> Subject: Re: [TN] EXTERNAL: [TN] BGA pad drop
>
>
>
> Hi Ben,
>
>
>
> I send a clear picture for your reference
>
>
>
> Lyon Yuan
>
>
>
> -----Original Message-----
>
> From: [log in to unmask] [mailto:[log in to unmask]] On Behalf Of
> Gumpert, Ben
>
> Sent: Wednesday, September 04, 2013 8:04 PM
>
> To: [log in to unmask]
>
> Subject: Re: [TN] EXTERNAL: [TN] BGA pad drop
>
>
>
> Lyon,
>
>
>
> I haven’t seen that.
>
> Typically the pads on the BGA are solder mask defined, which makes them
> much more secure than the usual non-solder mask defined pads on the PWB.
>
>
>
> Ben
>
>
>
> From: [log in to unmask] [mailto:[log in to unmask]]
>
> Sent: Wednesday, September 04, 2013 7:04 AM
>
> To: Gumpert, Ben
>
> Cc: TechNet
>
> Subject: Re:Re: [TN] EXTERNAL: [TN] BGA pad drop
>
>
>
> hi ben,
>
>
>
> it is pad missing from bga
>
> 在2013/09/04, "Gumpert, Ben" < <mailto:[log in to unmask]
> 3cmailto:[log in to unmask]> [log in to unmask]<mailto:
> [log in to unmask]>> 写道:
>
> Lyon, By 'pad drop' do you mean lifted pads? (Pads stayed with the BGA?)
> Usually this means that there wasn't enough heat - that the solder was not
> melted in all locations. Ben -----Original Message----- From: TechNet
>  <mailto:[mailto:[log in to unmask]]> [mailto:[log in to unmask]] On Behalf Of
> Lyon Yuan Sent: Wednesday, September 04, 2013 6:40 AM To:  <mailto:
> [log in to unmask]:[log in to unmask]> [log in to unmask]<mailto:
> [log in to unmask]> Subject: EXTERNAL: [TN] BGA pad drop guys,we found a few
> BGA pad drop after removed from pcba boards.what is reason to cause the
> issue
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-- 

   1. Bob Wettermann

847-767-5745

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