The reballing number is depend on the process. Parameters...

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‫ב-17 בספט 2013, בשעה 17:25, ‏"Stadem, Richard D." <[log in to unmask]> כתב/ה:‬

> AABUS, dependent on qualification results. This will vary from BGA to BGA. Some cannot be reballed at all, some can be reballed 10,000 times.
> Please understand that re-balling may violate the component warranty.
> 
> -----Original Message-----
> From: Lyon Yuan [mailto:[log in to unmask]] 
> Sent: Tuesday, September 17, 2013 8:34 AM
> To: 'TechNet E-Mail Forum'; Stadem, Richard D.
> Subject: RE: [TN] EXTERNAL: [TN] BGA pad drop
> 
> Hi Folks,
> 
> How many times can be allowed to re-balling BGA?
> 
> Lyon Yuan
> 
> -----Original Message-----
> From: [log in to unmask] [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
> Sent: Thursday, September 05, 2013 12:29 AM
> To: [log in to unmask]
> Subject: Re: [TN] EXTERNAL: [TN] BGA pad drop
> 
> Unless it was reballed and placed and soldered. The second heat cycle of removal may have caused the pad to come off.
> 
> From: Bob Wettermann [mailto:[log in to unmask]]
> Sent: Wednesday, September 04, 2013 11:24 AM
> To: TechNet E-Mail Forum; Stadem, Richard D.
> Subject: Re: [TN] EXTERNAL: [TN] BGA pad drop
> 
> Gents:
> Lyon wrote "Bob,
> 
> After removed BGA, we found pad of BGA was missing." From what the patient is telling us it happened UPON REMOVAL (not during reballing process) Bob W
> 
> On Wed, Sep 4, 2013 at 11:18 AM, Stadem, Richard D. <[log in to unmask]<mailto:[log in to unmask]>> wrote:
> I don't think so, as then the other pads would also display varying degrees of erosion. This appears to be a pad that was lifted during the reballing process, as part of the pad prep after rework (removal of the old solder).
> 
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]<mailto:[log in to unmask]>] On Behalf Of Gumpert, Ben
> Sent: Wednesday, September 04, 2013 9:20 AM
> To: [log in to unmask]<mailto:[log in to unmask]>
> Subject: Re: [TN] EXTERNAL: [TN] BGA pad drop Or potentially too much time at liquidus dissolved the pad away, or left minimal pad that was easily lifted.
> 
> Ben
> 
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]<mailto:[log in to unmask]>] On Behalf Of Steve Gregory
> Sent: Wednesday, September 04, 2013 10:16 AM
> To: [log in to unmask]<mailto:[log in to unmask]>
> Subject: Re: [TN] EXTERNAL: [TN] BGA pad drop Well, well, well....there's your answer. I think someone did not have a delicate touch when they cleaned the pads...
> 
> Steve
> 
> 
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]<mailto:[log in to unmask]>] On Behalf Of Lyon Yuan
> Sent: Wednesday, September 4, 2013 8:14 AM
> To: [log in to unmask]<mailto:[log in to unmask]>
> Subject: Re: [TN] EXTERNAL: [TN] BGA pad drop
> 
> Hi Steve
> 
> 
> 
> Yes, it was re-balled
> 
> 
> 
> Lyon Yuan
> 
> 
> 
> From: stephen gregory [mailto:[log in to unmask]<mailto:[log in to unmask]>]
> Sent: Wednesday, September 04, 2013 10:11 PM
> To: Lyon Yuan; TechNet E-Mail Forum
> Subject: Re: [TN] EXTERNAL: [TN] BGA pad drop
> 
> 
> 
> Hi Lyon!
> 
> 
> 
> Have your picture posted, it's here:
> 
> 
> 
> http://stevezeva.homestead.com/Pad_missing.JPG
> 
> 
> 
> Do you know if this BGA was re-balled?
> 
> 
> 
> Steve
> 
> 
> 
> From: Lyon Yuan <[log in to unmask]<mailto:[log in to unmask]>>
> To: 'stephen gregory' <[log in to unmask]<mailto:[log in to unmask]>>; 'Steve Gregory' <[log in to unmask]<mailto:[log in to unmask]>>
> Sent: Wednesday, September 4, 2013 8:00 AM
> Subject: RE: [TN] EXTERNAL: [TN] BGA pad drop
> 
> 
> 
> Steve,
> 
> 
> 
> Help to upload picture to web. Thanks
> 
> 
> 
> Lyon Yuan
> 
> 
> 
> 
> 
> -----Original Message-----
> From: Wenger, George M. [Contractor] [mailto:[log in to unmask]<mailto:[log in to unmask]>]
> Sent: Wednesday, September 04, 2013 9:54 PM
> To: Lyon Yuan
> Cc: stephen gregory; Steve Gregory
> Subject: RE: [TN] EXTERNAL: [TN] BGA pad drop
> 
> 
> 
> Lyon,
> 
> 
> 
> Attached is a link to his site.  The last emails I had for Steve are on the copy to line of this email  <http://stevezeva.homestead.com/> http://stevezeva.homestead.com/
> 
> 
> 
> 
> 
> Regards,
> 
> George
> 
> George M. Wenger
> 
> Failure Signature & Characterization Lab LLC
> 
> 609 Cokesbury Road, High Bridge, NJ 08829
> 
> (908) 638-8771<tel:%28908%29%20638-8771> Home (732) 309-8964<tel:%28732%29%20309-8964> Mobile
> 
> E-mail:  <mailto:[log in to unmask]<mailto:[log in to unmask]>> [log in to unmask]<mailto:[log in to unmask]>
> 
> <mailto:[log in to unmask]<mailto:[log in to unmask]>> [log in to unmask]<mailto:[log in to unmask]>
> 
> 
> 
> 
> 
> -----Original Message-----
> 
> From: Lyon Yuan [mailto:[log in to unmask]<mailto:[log in to unmask]>]
> 
> Sent: Wednesday, September 04, 2013 9:45 AM
> 
> To: Wenger, George M. [Contractor]
> 
> Subject: RE: [TN] EXTERNAL: [TN] BGA pad drop
> 
> 
> 
> George
> 
> 
> 
> Thanks, steve's email?
> 
> 
> 
> Lyon Yuan
> 
> 
> 
> -----Original Message-----
> 
> From: Wenger, George M. [Contractor] [mailto:[log in to unmask]<mailto:[log in to unmask]>]
> 
> Sent: Wednesday, September 04, 2013 9:35 PM
> 
> To: TechNet E-Mail Forum; Lyon Yuan
> 
> Subject: RE: [TN] EXTERNAL: [TN] BGA pad drop
> 
> 
> 
> Hi Lyon,
> 
> 
> 
> You might want to send the picture to Steve to post on his site so we all can see it.
> 
> 
> 
> Regards,
> 
> George
> 
> George M. Wenger
> 
> Failure Signature & Characterization Lab LLC
> 
> 609 Cokesbury Road, High Bridge, NJ 08829
> 
> (908) 638-8771<tel:%28908%29%20638-8771> Home (732) 309-8964<tel:%28732%29%20309-8964> Mobile
> 
> E-mail:  <mailto:[log in to unmask]<mailto:[log in to unmask]>> [log in to unmask]<mailto:[log in to unmask]>
> 
> <mailto:[log in to unmask]<mailto:[log in to unmask]>> [log in to unmask]<mailto:[log in to unmask]>
> 
> 
> 
> 
> 
> -----Original Message-----
> 
> From: TechNet [mailto:[log in to unmask]<mailto:[log in to unmask]>] On Behalf Of Lyon Yuan
> 
> Sent: Wednesday, September 04, 2013 9:32 AM
> 
> To: [log in to unmask]<mailto:[log in to unmask]>
> 
> Subject: Re: [TN] EXTERNAL: [TN] BGA pad drop
> 
> 
> 
> Hi Ben,
> 
> 
> 
> I send a clear picture for your reference
> 
> 
> 
> Lyon Yuan
> 
> 
> 
> -----Original Message-----
> 
> From: [log in to unmask]<mailto:[log in to unmask]> [mailto:[log in to unmask]<mailto:[log in to unmask]>] On Behalf Of Gumpert, Ben
> 
> Sent: Wednesday, September 04, 2013 8:04 PM
> 
> To: [log in to unmask]<mailto:[log in to unmask]>
> 
> Subject: Re: [TN] EXTERNAL: [TN] BGA pad drop
> 
> 
> 
> Lyon,
> 
> 
> 
> I haven’t seen that.
> 
> Typically the pads on the BGA are solder mask defined, which makes them much more secure than the usual non-solder mask defined pads on the PWB.
> 
> 
> 
> Ben
> 
> 
> 
> From: [log in to unmask]<mailto:[log in to unmask]> [mailto:[log in to unmask]<mailto:[log in to unmask]>]
> 
> Sent: Wednesday, September 04, 2013 7:04 AM
> 
> To: Gumpert, Ben
> 
> Cc: TechNet
> 
> Subject: Re:Re: [TN] EXTERNAL: [TN] BGA pad drop
> 
> 
> 
> hi ben,
> 
> 
> 
> it is pad missing from bga
> 
> 在2013/09/04， "Gumpert, Ben" < <mailto:[log in to unmask]<mailto:[log in to unmask]>%3cmailto:[log in to unmask]<mailto:[log in to unmask]>> [log in to unmask]<mailto:[log in to unmask]><mailto:[log in to unmask]<mailto:[log in to unmask]>>> 写道：
> 
> Lyon, By 'pad drop' do you mean lifted pads? (Pads stayed with the BGA?) Usually this means that there wasn't enough heat - that the solder was not melted in all locations. Ben -----Original Message----- From: TechNet  <mailto:[mailto:[log in to unmask]<mailto:[log in to unmask]>]> [mailto:[log in to unmask]<mailto:[log in to unmask]>] On Behalf Of Lyon Yuan Sent: Wednesday, September 04, 2013 6:40 AM To:  <mailto:[log in to unmask]<mailto:[log in to unmask]>%3cmailto:[log in to unmask]<mailto:[log in to unmask]>> [log in to unmask]<mailto:[log in to unmask]><mailto:[log in to unmask]<mailto:[log in to unmask]>> Subject: EXTERNAL: [TN] BGA pad drop guys,we found a few BGA pad drop after removed from pcba boards.what is reason to cause the issue ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or  <mailto:[log in to unmask]<mailto:[log in to unmask]>%3cmailto:[log in to unmask]<mailto:[log in to unmask]>> [log in to unmask]<mailto:[log in to unmask]><mailto:[log in to unmask]<mailto:[log in to unmask]>> ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or  <mailto:[log in to unmask]<mailto:[log in to unmask]>%3cmailto:[log in to unmask]<mailto:[log in to unmask]>> [log in to unmask]<mailto:[log in to unmask]><mailto:[log in to unmask]<mailto:[log in to unmask]>> ______________________________________________________________________
> 
> 
> 
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> 
> --
> 
>  1.  Bob Wettermann
> 847-767-5745
> 
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