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Subject:
From:
Steve Gregory <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Steve Gregory <[log in to unmask]>
Date:
Wed, 4 Sep 2013 09:12:27 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (1 lines)
Hi Lyon,

Most commonly, people use solder-wick to clean the pads of a BGA if it is to be re-balled. This is a delicate operation, and great care must be used when doing this. The solder-wick must not be dragged across the pads, and the soldering iron and wick must be removed at the same time. I have seen pads pulled when the iron is removed first, then the wick pulled after the solder has solidified...the pad comes off with the wick.

Steve 


-----Original Message-----
From: Lyon Yuan [mailto:[log in to unmask]] 
Sent: Wednesday, September 4, 2013 8:21 AM
To: Steve Gregory; [log in to unmask]
Subject: RE: [TN] EXTERNAL: [TN] BGA pad drop

Hi Steve,

Sorry, can you give more details? Thanks

Lyon Yuan

-----Original Message-----
From: Steve Gregory [mailto:[log in to unmask]] 
Sent: Wednesday, September 04, 2013 10:16 PM
To: [log in to unmask]; Lyon Yuan
Subject: RE: [TN] EXTERNAL: [TN] BGA pad drop

Well, well, well....there's your answer. I think someone did not have a delicate touch when they cleaned the pads...

Steve 


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Lyon Yuan
Sent: Wednesday, September 4, 2013 8:14 AM
To: [log in to unmask]
Subject: Re: [TN] EXTERNAL: [TN] BGA pad drop

Hi Steve

 

Yes, it was re-balled

 

Lyon Yuan

 

From: stephen gregory [mailto:[log in to unmask]]
Sent: Wednesday, September 04, 2013 10:11 PM
To: Lyon Yuan; TechNet E-Mail Forum
Subject: Re: [TN] EXTERNAL: [TN] BGA pad drop

 

Hi Lyon!

 

Have your picture posted, it's here:

 

http://stevezeva.homestead.com/Pad_missing.JPG

 

Do you know if this BGA was re-balled?

 

Steve

 

From: Lyon Yuan <[log in to unmask]>
To: 'stephen gregory' <[log in to unmask]>; 'Steve Gregory' <[log in to unmask]>
Sent: Wednesday, September 4, 2013 8:00 AM
Subject: RE: [TN] EXTERNAL: [TN] BGA pad drop

 

Steve,

 

Help to upload picture to web. Thanks

 

Lyon Yuan

 

 

-----Original Message-----
From: Wenger, George M. [Contractor] [mailto:[log in to unmask]]
Sent: Wednesday, September 04, 2013 9:54 PM
To: Lyon Yuan
Cc: stephen gregory; Steve Gregory
Subject: RE: [TN] EXTERNAL: [TN] BGA pad drop

 

Lyon,

 

Attached is a link to his site.  The last emails I had for Steve are on the copy to line of this email  <http://stevezeva.homestead.com/> http://stevezeva.homestead.com/

 

 

Regards,

George

George M. Wenger

Failure Signature & Characterization Lab LLC

609 Cokesbury Road, High Bridge, NJ 08829

(908) 638-8771 Home (732) 309-8964 Mobile

E-mail:  <mailto:[log in to unmask]> [log in to unmask]

 <mailto:[log in to unmask]> [log in to unmask]

 

 

-----Original Message-----

From: Lyon Yuan [mailto:[log in to unmask]]

Sent: Wednesday, September 04, 2013 9:45 AM

To: Wenger, George M. [Contractor]

Subject: RE: [TN] EXTERNAL: [TN] BGA pad drop

 

George

 

Thanks, steve's email?

 

Lyon Yuan

 

-----Original Message-----

From: Wenger, George M. [Contractor] [mailto:[log in to unmask]]

Sent: Wednesday, September 04, 2013 9:35 PM

To: TechNet E-Mail Forum; Lyon Yuan

Subject: RE: [TN] EXTERNAL: [TN] BGA pad drop

 

Hi Lyon,

 

You might want to send the picture to Steve to post on his site so we all can see it.

 

Regards,

George

George M. Wenger

Failure Signature & Characterization Lab LLC

609 Cokesbury Road, High Bridge, NJ 08829

(908) 638-8771 Home (732) 309-8964 Mobile

E-mail:  <mailto:[log in to unmask]> [log in to unmask]

 <mailto:[log in to unmask]> [log in to unmask]

 

 

-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Lyon Yuan

Sent: Wednesday, September 04, 2013 9:32 AM

To: [log in to unmask]

Subject: Re: [TN] EXTERNAL: [TN] BGA pad drop

 

Hi Ben,

 

I send a clear picture for your reference

 

Lyon Yuan

 

-----Original Message-----

From: [log in to unmask] [mailto:[log in to unmask]] On Behalf Of Gumpert, Ben

Sent: Wednesday, September 04, 2013 8:04 PM

To: [log in to unmask]

Subject: Re: [TN] EXTERNAL: [TN] BGA pad drop

 

Lyon,

 

I haven’t seen that.

Typically the pads on the BGA are solder mask defined, which makes them much more secure than the usual non-solder mask defined pads on the PWB.

 

Ben

 

From: [log in to unmask] [mailto:[log in to unmask]]

Sent: Wednesday, September 04, 2013 7:04 AM

To: Gumpert, Ben

Cc: TechNet

Subject: Re:Re: [TN] EXTERNAL: [TN] BGA pad drop

 

hi ben,

 

it is pad missing from bga

在2013/09/04, "Gumpert, Ben" < <mailto:[log in to unmask]:[log in to unmask]> [log in to unmask]<mailto:[log in to unmask]>> 写道:

Lyon, By 'pad drop' do you mean lifted pads? (Pads stayed with the BGA?) Usually this means that there wasn't enough heat - that the solder was not melted in all locations. Ben -----Original Message----- From: TechNet  <mailto:[mailto:[log in to unmask]]> [mailto:[log in to unmask]] On Behalf Of Lyon Yuan Sent: Wednesday, September 04, 2013 6:40 AM To:  <mailto:[log in to unmask]:[log in to unmask]> [log in to unmask]<mailto:[log in to unmask]> Subject: EXTERNAL: [TN] BGA pad drop guys,we found a few BGA pad drop after removed from pcba boards.what is reason to cause the issue ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or  <mailto:[log in to unmask]:[log in to unmask]> [log in to unmask]<mailto:[log in to unmask]> ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or  <mailto:[log in to unmask]:[log in to unmask]> [log in to unmask]<mailto:[log in to unmask]> ______________________________________________________________________

 

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