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September 2013

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Subject:
Re: EXTERNAL: [TN] BGA pad drop
From:
Bob Wettermann <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Bob Wettermann <[log in to unmask]>
Date:
Wed, 4 Sep 2013 09:25:13 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (177 lines) 
Do we know where in the process the defect occured?

Was it after device removal? At site prep? After reballing?

Bob


On Wed, Sep 4, 2013 at 9:10 AM, stephen gregory <
[log in to unmask]> wrote:

> Hi Lyon!
>
> Have your picture posted, it's here:
>
> http://stevezeva.homestead.com/Pad_missing.JPG
>
> Do you know if this BGA was re-balled?
>
> Steve
>
>
> ________________________________
>  From: Lyon Yuan <[log in to unmask]>
> To: 'stephen gregory' <[log in to unmask]>; 'Steve Gregory'
> <[log in to unmask]>
> Sent: Wednesday, September 4, 2013 8:00 AM
> Subject: RE: [TN] EXTERNAL: [TN] BGA pad drop
>
>
>
> Steve,
>
> Help to upload picture to web. Thanks
>
> Lyon Yuan
>
>
> -----Original Message-----
> From: Wenger, George M. [Contractor] [mailto:[log in to unmask]]
> Sent: Wednesday, September 04, 2013 9:54 PM
> To: Lyon Yuan
> Cc: stephen gregory; Steve Gregory
> Subject: RE: [TN] EXTERNAL: [TN] BGA pad drop
>
> Lyon,
>
> Attached is a link to his site.  The last emails I had for Steve are on
> the copy to line of this email http://stevezeva.homestead.com/
>
>
> Regards,
> George
> George M. Wenger
> Failure Signature & Characterization Lab LLC
> 609 Cokesbury Road, High Bridge, NJ 08829
> (908) 638-8771 Home (732) 309-8964 Mobile
> E-mail: [log in to unmask]
> [log in to unmask]
>
>
> -----Original Message-----
> From: Lyon Yuan [mailto:[log in to unmask]]
> Sent: Wednesday, September 04, 2013 9:45 AM
> To: Wenger, George M. [Contractor]
> Subject: RE: [TN] EXTERNAL: [TN] BGA pad drop
>
> George
>
> Thanks, steve's email?
>
> Lyon Yuan
>
> -----Original Message-----
> From: Wenger, George M. [Contractor] [mailto:[log in to unmask]]
> Sent: Wednesday, September 04, 2013 9:35 PM
> To: TechNet E-Mail Forum; Lyon Yuan
> Subject: RE: [TN] EXTERNAL: [TN] BGA pad drop
>
> Hi Lyon,
>
> You might want to send the picture to Steve to post on his site so we all
> can see it.
>
> Regards,
> George
> George M. Wenger
> Failure Signature & Characterization Lab LLC
> 609 Cokesbury Road, High Bridge, NJ 08829
> (908) 638-8771 Home (732) 309-8964 Mobile
> E-mail: [log in to unmask]
> [log in to unmask]
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Lyon Yuan
> Sent: Wednesday, September 04, 2013 9:32 AM
> To: [log in to unmask]
> Subject: Re: [TN] EXTERNAL: [TN] BGA pad drop
>
> Hi Ben,
>
> I send a clear picture for your reference
>
> Lyon Yuan
>
> -----Original Message-----
> From: [log in to unmask] [mailto:[log in to unmask]] On Behalf Of
> Gumpert, Ben
> Sent: Wednesday, September 04, 2013 8:04 PM
> To: [log in to unmask]
> Subject: Re: [TN] EXTERNAL: [TN] BGA pad drop
>
> Lyon,
>
> I haven’t seen that.
> Typically the pads on the BGA are solder mask defined, which makes them
> much more secure than the usual non-solder mask defined pads on the PWB.
>
> Ben
>
> From: [log in to unmask] [mailto:[log in to unmask]]
> Sent: Wednesday, September 04, 2013 7:04 AM
> To: Gumpert, Ben
> Cc: TechNet
> Subject: Re:Re: [TN] EXTERNAL: [TN] BGA pad drop
>
> hi ben,
>
> it is pad missing from bga
> 在2013/09/04，"Gumpert, Ben" <[log in to unmask]<mailto:
> [log in to unmask]>> 写道：
> Lyon, By 'pad drop' do you mean lifted pads? (Pads stayed with the BGA?)
> Usually this means that there wasn't enough heat - that the solder was not
> melted in all locations. Ben -----Original Message----- From: TechNet
> [mailto:[log in to unmask]] On Behalf Of Lyon Yuan Sent: Wednesday,
> September 04, 2013 6:40 AM To: [log in to unmask]<mailto:[log in to unmask]>
> Subject: EXTERNAL: [TN] BGA pad drop guys,we found a few BGA pad drop after
> removed from pcba boards.what is reason to cause the issue
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-- 

   1. Bob Wettermann

847-767-5745

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