Hi Eva - the IPC STD-001/IPC 610 committees will not be putting any LGA 
voiding criteria into the specifications without substantiating data and 
so far, no one has submitted any data sets for committee assessment/review 
that I am aware of. If anyone has LGA voiding data, the committees would 
love to see them. The committees just reviewed BGA void data that the 
industry submitted for assessment/review and having data/test results that 
could be discussed/critiqued was a critical, key parameter for creating 
workmanship criteria for industry wide use.

Dave Hillman
Rockwell Collins
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From:   Eva J <[log in to unmask]>
To:     <[log in to unmask]>
Date:   09/18/2013 06:55 PM
Subject:        Re: [TN] Linear LTM4613 uModule LGA, to bump, or not to 
bump?
Sent by:        TechNet <[log in to unmask]>



I have bumped LGAs with success..less voiding ...extra thermal cycle and
processing. Also, check into eliminating solder mask under LGA component
when designing PCB if possible to allow for out gassing and less voids.
Hopefully IPC A 610 will have voiding criteria in Rev F.
On Sep 18, 2013 6:40 PM, "Steve Gregory" <[log in to unmask]> wrote:

> Hi All,
>
>
>
> Haven't messed around with LGA's except for a couple of times. Don't
> remember too much except that they were a real PIA.
>
>
>
> Got a possibility that I might see a board that has four Linear
> Technology LTM4613 devices on it.
>
>
>
> If you had your 'druthers, would you bump or ball them before assembling
> them on a board or not?
>
>
>
> Steve
>
>
>
>
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