Hi Steve - we have assembled with both bumped and non-bumped LGA 
components with good success for both types. The critical parameter is 
your stencil print process - put the bulk of your process implementation 
effort on that task. If you get the solder paste print right, the rest is 
a piece of cake. The level of voiding will depend on your specific solder 
paste product you are using and having a reasonable reflow profile. If you 
are having success with BGAs components and get a good LGA solder paste 
print, you should not have any issues. Good Luck.

Dave Hillman
Rockwell Collins
[log in to unmask]



From:   Steve Gregory <[log in to unmask]>
To:     <[log in to unmask]>
Date:   09/18/2013 05:38 PM
Subject:        [TN] Linear LTM4613 uModule LGA, to bump, or not to bump?
Sent by:        TechNet <[log in to unmask]>



Hi All,

 

Haven't messed around with LGA's except for a couple of times. Don't
remember too much except that they were a real PIA.

 

Got a possibility that I might see a board that has four Linear
Technology LTM4613 devices on it. 

 

If you had your 'druthers, would you bump or ball them before assembling
them on a board or not? 

 

Steve 

 


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