I have bumped LGAs with success..less voiding ...extra thermal cycle and
processing. Also, check into eliminating solder mask under LGA component
when designing PCB if possible to allow for out gassing and less voids.
Hopefully IPC A 610 will have voiding criteria in Rev F.
On Sep 18, 2013 6:40 PM, "Steve Gregory" <[log in to unmask]> wrote:

> Hi All,
>
>
>
> Haven't messed around with LGA's except for a couple of times. Don't
> remember too much except that they were a real PIA.
>
>
>
> Got a possibility that I might see a board that has four Linear
> Technology LTM4613 devices on it.
>
>
>
> If you had your 'druthers, would you bump or ball them before assembling
> them on a board or not?
>
>
>
> Steve
>
>
>
>
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