Steve:

Bumping is the better approach w/this device.

Look at the data sheet to see if there are embedded devices. This may
change how you handle and fixture the part.

We have had good success in placing these type of devices w/little voiding.

Bob



On Wed, Sep 18, 2013 at 5:36 PM, Steve Gregory <[log in to unmask]> wrote:

> Hi All,
>
>
>
> Haven't messed around with LGA's except for a couple of times. Don't
> remember too much except that they were a real PIA.
>
>
>
> Got a possibility that I might see a board that has four Linear
> Technology LTM4613 devices on it.
>
>
>
> If you had your 'druthers, would you bump or ball them before assembling
> them on a board or not?
>
>
>
> Steve
>
>
>
>
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-- 

   1. Bob Wettermann

847-767-5745


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