Contact resistance change less than 7-10% after sequential reliability tests-what ever your product design requirements are. If the spec of contact delta R is less than 20%.   Go ask your designer. 
--------------------------
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----- Original Message -----
From: Lyon Yuan [mailto:[log in to unmask]]
Sent: Saturday, September 14, 2013 11:49 AM
To: [log in to unmask] <[log in to unmask]>
Subject: Re: [TN] matching /connection issue on DIMM and memory

How to clean DIMM Socket before inserting memory in manufacture process

Lyon Yuan

-----Original Message-----
From: McGrath, Jim [mailto:[log in to unmask]] 
Sent: Thursday, September 12, 2013 9:09 PM
To: [log in to unmask]; [log in to unmask]
Subject: Re: [TN] matching /connection issue on DIMM and memory

I have been involved with DIMM for years. First, although all DIMM
connectors look alike, they all do not function the same. Both the module
gold pads and connector contacts need to be clean. The reseat issue is not
unusual especially if cheap connectors are used or the manufacturing
environment is not clean allowing debris to settle into the connector. Also,
some DIMM makers don't treat the gold contact area on the module as the
contact interface it is. Gold flash can be a problem. No or this nickel
underplate is another. 
Jim

----- Original Message -----
From: Lyon Yuan [mailto:[log in to unmask]]
Sent: Thursday, September 12, 2013 07:39 AM Eastern Standard Time
To: [log in to unmask] <[log in to unmask]>
Subject: [TN] matching /connection issue on DIMM and memory

 

Hi Folks,

 

Anybody has experienced on matching /connection issue on DIMM and memory? We
found huge quantify failed on DIMM testing . but all failed blade server
passed after reseat memory. We want to improve our FPY

 

 

Lyon Yuan

 



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