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Date: | Thu, 19 Sep 2013 09:03:00 +0200 |
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Hi Steve,
we have assembled LGAs without Balls on some types of boards. I'm with
Dave. You need a good solderpaste, printing process and solderingprofile.
Successfull processing of BGAs (without huge amount of voids) is a good
startingpoint. Because of the small standoff you may have to check if
your cleaningprocess is sufficient.
Regards,
Frank
Von: "David D. Hillman" <[log in to unmask]>
An: <[log in to unmask]>
Datum: 19.09.2013 04:37
Betreff: Re: [TN] Linear LTM4613 uModule LGA, to bump, or not to
bump?
Gesendet von: TechNet <[log in to unmask]>
Hi Steve - we have assembled with both bumped and non-bumped LGA
components with good success for both types. The critical parameter is
your stencil print process - put the bulk of your process implementation
effort on that task. If you get the solder paste print right, the rest is
a piece of cake. The level of voiding will depend on your specific solder
paste product you are using and having a reasonable reflow profile. If you
are having success with BGAs components and get a good LGA solder paste
print, you should not have any issues. Good Luck.
Dave Hillman
Rockwell Collins
[log in to unmask]
From: Steve Gregory <[log in to unmask]>
To: <[log in to unmask]>
Date: 09/18/2013 05:38 PM
Subject: [TN] Linear LTM4613 uModule LGA, to bump, or not to bump?
Sent by: TechNet <[log in to unmask]>
Hi All,
Haven't messed around with LGA's except for a couple of times. Don't
remember too much except that they were a real PIA.
Got a possibility that I might see a board that has four Linear
Technology LTM4613 devices on it.
If you had your 'druthers, would you bump or ball them before assembling
them on a board or not?
Steve
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