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Date: | Wed, 4 Sep 2013 21:32:09 +0800 |
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Hi Ben,
I send a clear picture for your reference
Lyon Yuan
-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]] On Behalf Of Gumpert, Ben
Sent: Wednesday, September 04, 2013 8:04 PM
To: [log in to unmask]
Subject: Re: [TN] EXTERNAL: [TN] BGA pad drop
Lyon,
I haven’t seen that.
Typically the pads on the BGA are solder mask defined, which makes them much more secure than the usual non-solder mask defined pads on the PWB.
Ben
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Wednesday, September 04, 2013 7:04 AM
To: Gumpert, Ben
Cc: TechNet
Subject: Re:Re: [TN] EXTERNAL: [TN] BGA pad drop
hi ben,
it is pad missing from bga
在2013/09/04, "Gumpert, Ben" <[log in to unmask]<mailto:[log in to unmask]>> 写道:
Lyon, By 'pad drop' do you mean lifted pads? (Pads stayed with the BGA?) Usually this means that there wasn't enough heat - that the solder was not melted in all locations. Ben -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Lyon Yuan Sent: Wednesday, September 04, 2013 6:40 AM To: [log in to unmask]<mailto:[log in to unmask]> Subject: EXTERNAL: [TN] BGA pad drop guys,we found a few BGA pad drop after removed from pcba boards.what is reason to cause the issue ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask]<mailto:[log in to unmask]> ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask]<mailto:[log in to unmask]> ______________________________________________________________________
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