All - I'm looking for some input regarding component spacing requirements at high altitudes (2,300 M/7,500 ft).
I know there are MANY other factors when considering designing for high altitude; pcb material, power supply, components, application, etc.
In our case, our medical analysis unit/devices will be on the ground, but possibly in high altitude, remote locations.
Any and all suggestions are welcome.
Thank You All for your insight and time.
SIEMENS
Michael Kuczynski Healthcare Diagnostics Inc.
Product Eng. II CID 511 Benedict Ave.
914-524-3118 (Ph) Tarrytown, NY 10591
914-524-3322 (Fax) Mail Stop P25-1-C
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