Well, well, well....there's your answer. I think someone did not have a delicate touch when they cleaned the pads...
Steve
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Lyon Yuan
Sent: Wednesday, September 4, 2013 8:14 AM
To: [log in to unmask]
Subject: Re: [TN] EXTERNAL: [TN] BGA pad drop
Hi Steve
Yes, it was re-balled
Lyon Yuan
From: stephen gregory [mailto:[log in to unmask]]
Sent: Wednesday, September 04, 2013 10:11 PM
To: Lyon Yuan; TechNet E-Mail Forum
Subject: Re: [TN] EXTERNAL: [TN] BGA pad drop
Hi Lyon!
Have your picture posted, it's here:
http://stevezeva.homestead.com/Pad_missing.JPG
Do you know if this BGA was re-balled?
Steve
From: Lyon Yuan <[log in to unmask]>
To: 'stephen gregory' <[log in to unmask]>; 'Steve Gregory' <[log in to unmask]>
Sent: Wednesday, September 4, 2013 8:00 AM
Subject: RE: [TN] EXTERNAL: [TN] BGA pad drop
Steve,
Help to upload picture to web. Thanks
Lyon Yuan
-----Original Message-----
From: Wenger, George M. [Contractor] [mailto:[log in to unmask]]
Sent: Wednesday, September 04, 2013 9:54 PM
To: Lyon Yuan
Cc: stephen gregory; Steve Gregory
Subject: RE: [TN] EXTERNAL: [TN] BGA pad drop
Lyon,
Attached is a link to his site. The last emails I had for Steve are on the copy to line of this email <http://stevezeva.homestead.com/> http://stevezeva.homestead.com/
Regards,
George
George M. Wenger
Failure Signature & Characterization Lab LLC
609 Cokesbury Road, High Bridge, NJ 08829
(908) 638-8771 Home (732) 309-8964 Mobile
E-mail: <mailto:[log in to unmask]> [log in to unmask]
<mailto:[log in to unmask]> [log in to unmask]
-----Original Message-----
From: Lyon Yuan [mailto:[log in to unmask]]
Sent: Wednesday, September 04, 2013 9:45 AM
To: Wenger, George M. [Contractor]
Subject: RE: [TN] EXTERNAL: [TN] BGA pad drop
George
Thanks, steve's email?
Lyon Yuan
-----Original Message-----
From: Wenger, George M. [Contractor] [mailto:[log in to unmask]]
Sent: Wednesday, September 04, 2013 9:35 PM
To: TechNet E-Mail Forum; Lyon Yuan
Subject: RE: [TN] EXTERNAL: [TN] BGA pad drop
Hi Lyon,
You might want to send the picture to Steve to post on his site so we all can see it.
Regards,
George
George M. Wenger
Failure Signature & Characterization Lab LLC
609 Cokesbury Road, High Bridge, NJ 08829
(908) 638-8771 Home (732) 309-8964 Mobile
E-mail: <mailto:[log in to unmask]> [log in to unmask]
<mailto:[log in to unmask]> [log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Lyon Yuan
Sent: Wednesday, September 04, 2013 9:32 AM
To: [log in to unmask]
Subject: Re: [TN] EXTERNAL: [TN] BGA pad drop
Hi Ben,
I send a clear picture for your reference
Lyon Yuan
-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]] On Behalf Of Gumpert, Ben
Sent: Wednesday, September 04, 2013 8:04 PM
To: [log in to unmask]
Subject: Re: [TN] EXTERNAL: [TN] BGA pad drop
Lyon,
I haven’t seen that.
Typically the pads on the BGA are solder mask defined, which makes them much more secure than the usual non-solder mask defined pads on the PWB.
Ben
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Wednesday, September 04, 2013 7:04 AM
To: Gumpert, Ben
Cc: TechNet
Subject: Re:Re: [TN] EXTERNAL: [TN] BGA pad drop
hi ben,
it is pad missing from bga
在2013/09/04， "Gumpert, Ben" < <mailto:[log in to unmask]:[log in to unmask]> [log in to unmask]<mailto:[log in to unmask]>> 写道：
Lyon, By 'pad drop' do you mean lifted pads? (Pads stayed with the BGA?) Usually this means that there wasn't enough heat - that the solder was not melted in all locations. Ben -----Original Message----- From: TechNet <mailto:[mailto:[log in to unmask]]> [mailto:[log in to unmask]] On Behalf Of Lyon Yuan Sent: Wednesday, September 04, 2013 6:40 AM To: <mailto:[log in to unmask]:[log in to unmask]> [log in to unmask]<mailto:[log in to unmask]> Subject: EXTERNAL: [TN] BGA pad drop guys,we found a few BGA pad drop after removed from pcba boards.what is reason to cause the issue ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or <mailto:[log in to unmask]:[log in to unmask]> [log in to unmask]<mailto:[log in to unmask]> ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or <mailto:[log in to unmask]:[log in to unmask]> [log in to unmask]<mailto:[log in to unmask]> ______________________________________________________________________
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