Hi Nagaraj,
A few more comments,
1) Like I mentioned in last email, I don't think more plating is needed for
3/8 oz base copper as long as you have a 1 mil PTH plating requirement.
2) Please clarify planarity. If you mean copper surface planarity and edge
roughness of a trace, it doesn't have much to do with plating distribution.
3) You can look at the PTH x-section or at least the x-section report to
evaluate the plating distribution if needed. There should be surface plating
copper and PYH hole copper thickness on the report. The more closer of the
two, the better plating distribution is. However this is no specification
regarding plating distribution.
Hope this helps.
Best Regards,
Jason Zhao
VP of North America Operations
Sunshine Circuits
3400 Silverstone Drive, Suite 139, Plano, TX 75023
US Cell 510-468-4412, China Cell 131-62722392
www.sunshinepcbgroup.com
-------------
We will be exhibiting at PCB WEST 2013. Come see us at Booth #111.
September 25th, 2013, Santa Clara Convention Center, San Jose, CA.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Nagaraj Shanmugam
Sent: Thursday, August 08, 2013 1:26 AM
To: [log in to unmask]
Subject: Re: [TN] Starting copper foil thickness on External layers
Thanks for valuable inputs as always :-) Our design has WLP sockets with
application involving High speed/high power signals which needs planarity
and proper trace width for better performance, hence have reservations on
the starting copper and uniform Plating distribution.
By what method or report from Fabricator can help in ensuring the proper
plating distribution is met on bare board on allowing deviation for thinner
starting copper.
Good day!!
Thanks,
Nagaraj.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of EIMCNews
Sent: 07 August 2013 9:04
To: [log in to unmask]
Subject: Re: [TN] Starting copper foil thickness on External layers
Surface copper planarity is indeed a problem unless you mediate the current
density distribution problem that is inherent in plating circuit boards.
You're better off starting with thicker base copper or you'll have to suffer
the consequences of poor plating thickness distribution.
EIMCNews
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Robert Kondner
Sent: Wednesday, August 07, 2013 7:31 AM
To: [log in to unmask]
Subject: Re: [TN] Starting copper foil thickness on External layers
Starting thinner and plating up means more copper in the vias. In general
that sounds good to me but watch out for via plugging. Through holes that
were tight to begin with could end up too small unless the holes are drilled
a little bigger.
Bob K.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Nagaraj Shanmugam
Sent: Wednesday, August 07, 2013 9:18 AM
To: [log in to unmask]
Subject: [TN] Starting copper foil thickness on External layers
Hi All,
We have pcb fab notes calling as - "starting copper weight can be 0.5oz as
long as the finish copper weight is 1 oz" (or 2oz on high power designs)
Now, few fabricators started to ask for deviation to use 3/8oz for starting
copper instead 0.5oz and will make finished copper thickness required in
plating.
What are the pros and cons of having smaller copper foil thickness as
starting copper weight?
I am concerned about the planarity of the surface due to longer plating time
on 3/8oz.
Appreciate any information on this.
Thanks,
Nagaraj.
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