The CAM software has all the data you need to know how much platable area
there is and where it is located on the surface of the board.  It is up to
the electroplater to configure the set-up based on the board lay-out.  This
can be done either with shielding (non-conductive shields) or active copper
thieving using some sort of ancillary electrolytic device.  To do this
precisely it is advisable to have an accurate computer simulation to know
how and where to configure these devices.

EIMCNews

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Nagaraj Shanmugam
Sent: Wednesday, August 07, 2013 11:26 PM
To: [log in to unmask]
Subject: Re: [TN] Starting copper foil thickness on External layers

Thanks for valuable inputs as always :-) Our design has WLP sockets with
application involving High speed/high power signals which needs planarity
and proper trace width for better performance, hence have reservations on
the starting copper and uniform Plating distribution.

By what method or report from Fabricator can help in ensuring the proper
plating distribution is met on bare board on allowing deviation for thinner
starting copper.

Good day!!
Thanks,
Nagaraj.


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of EIMCNews
Sent: 07 August 2013 9:04
To: [log in to unmask]
Subject: Re: [TN] Starting copper foil thickness on External layers

Surface copper planarity is indeed a problem unless you mediate the current
density distribution problem that is inherent in plating circuit boards.
You're better off starting with thicker base copper or you'll have to suffer
the consequences of poor plating thickness distribution.

EIMCNews

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Robert Kondner
Sent: Wednesday, August 07, 2013 7:31 AM
To: [log in to unmask]
Subject: Re: [TN] Starting copper foil thickness on External layers

Starting thinner and plating up means more copper in the vias. In general
that sounds good to me but watch out for via plugging. Through holes that
were tight to begin with could end up too small unless the holes are drilled
a little bigger. 

Bob K.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Nagaraj Shanmugam
Sent: Wednesday, August 07, 2013 9:18 AM
To: [log in to unmask]
Subject: [TN] Starting copper foil thickness on External layers

Hi All,

We have pcb fab notes calling as - "starting copper weight can be 0.5oz  as
long as the finish copper weight is 1 oz" (or 2oz on high power designs)
Now, few fabricators started to ask for deviation to use 3/8oz for starting
copper instead 0.5oz and will make finished copper thickness required in
plating.

What are the pros and cons of having smaller copper foil thickness  as
starting copper weight?
I am concerned about the planarity of the surface due to longer plating time
on 3/8oz.

Appreciate any information on this.
Thanks,
Nagaraj.

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