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August 2013

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Subject:
From:
Frank Kriesch <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Thu, 8 Aug 2013 13:00:17 +0200
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text/plain
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Victor,

have a look at picture 10-49 and 10-50. There you can see SMD-Components 
on lifted pads. But written criteria always take precedence over 
illustrations.
There is no distinction between SMD and PTH Pads in the describing text.


Regards


Frank


Von:    Victor Hernandez <[log in to unmask]>
An:     <[log in to unmask]>
Datum:  07.08.2013 18:55
Betreff:        [TN] IPC-610E, section 10.3.2, Conductors/Lands - Lifted 
Pads/Lands (Con't)
Gesendet von:   TechNet <[log in to unmask]>



Fellow TechNetters:

   Can someone else interpret the stated criteria for section 10.3.2. 
Figures 10-48 thru 50.   Does this criteria solely pertain to 
PTH/conductor lands or is this also pertain to Surface Mount Pads, 
J-Leads, Gull Wing, SMT, etc....   I don't see how the industry can permit 
lifted copper pads from the laminate.   Is this criteria for Post 
soldiering Process or what?

Victor,

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