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August 2013

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Subject:
From:
Victor Hernandez <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 7 Aug 2013 11:54:44 -0500
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Fellow TechNetters:

   Can someone else interpret the stated criteria for section 10.3.2.  Figures 10-48 thru 50.   Does this criteria solely pertain to PTH/conductor lands or is this also pertain to Surface Mount Pads, J-Leads, Gull Wing, SMT, etc....   I don't see how the industry can permit lifted copper pads from the laminate.   Is this criteria for Post soldiering Process or what?

Victor,

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