Hi All,

We have pcb fab notes calling as - "starting copper weight can be 0.5oz  as long as the finish copper weight is 1 oz" (or 2oz on high power designs)
Now, few fabricators started to ask for deviation to use 3/8oz for starting copper instead 0.5oz and will make finished copper thickness required in plating.

What are the pros and cons of having smaller copper foil thickness  as starting copper weight?
I am concerned about the planarity of the surface due to longer plating time on 3/8oz.

Appreciate any information on this.
Thanks,
Nagaraj.

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