Much noise for a single void. 30% tells me it wasn't from the soldering
process but existed even before. With other words a defect ball. The
failure seems to be far out from Weibull's cc, i.e. <6S, so it's not worth
much more jogging.

Inge


On 30 July 2013 20:25, David D. Hillman <[log in to unmask]>wrote:

> Hi Leland - I love the supplier's comment as the existence of the 30% void
> demonstrates the statement to not be true. Was the 30% void an observation
> or was it associated with an component failure? Do you have open microvias
> in the pads? Also -  the JSTD-001 committee is revising the BGA void
> criteria to 30% based on a series of test results submitted to the
> committee.
>
> Dave
>
>
>
> From:   Leland Woodall <[log in to unmask]>
> To:     <[log in to unmask]>
> Date:   07/30/2013 01:19 PM
> Subject:        [TN] Singular 30% Void and Oversize Ball Diameter
> Sent by:        TechNet <[log in to unmask]>
>
>
>
> Folks,
>
> We run thousands of boards a day, and almost every one carries a BGA.  We
> inspect each with inline X-ray.
>
> Last week, we had one single ball to fail for a 30% void and an oversize
> diameter.  We contacted the supplier, and they said their process was
> incapable of sending out such a defect.
>
> We've never had a void over 5%, and even those are incredibly rare.
>
> What within our process might have caused this, and do you agree with the
> statement of the supplier?  How do you recommend we analyze the failure?
>
> Thanks in advance for your help!
>
> Leland
>
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