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August 2013

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Subject:
From:
Richard Kraszewski <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Richard Kraszewski <[log in to unmask]>
Date:
Tue, 27 Aug 2013 19:59:03 +0000
Content-Type:
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Chip crises come in all shapes and sizes. 

Here is a rather serious one we are experiencing in the state of Wisconsin.

http://rapidcityjournal.com/news/drought-causes-shortage-in-wisconsin-cow-chip-throw/article_38bfa2a8-b4cb-5693-9602-612cd454c8f3.html


Rich Kraszewski

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bob Landman
Sent: Tuesday, August 27, 2013 12:54 PM
To: [log in to unmask]
Subject: Re: [TN] Flip Chips

To measure residual gases such as O2 at 100ppm I'd suggest a RGA

http://www.thinksrs.com/products/RGA.htm 

Bob Landman

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
Sent: Tuesday, August 27, 2013 1:39 PM
To: [log in to unmask]
Subject: Re: [TN] Flip Chips

Hmm, you are living dangerously.  You do need good control to make sure it all melted at same time, unless it is very few C4s.  you possibly looking at very aggressive flux since your reflow tool is not optimal. No recommendation here.  

Joyce Koo
Researcher
Materials Interconnect Lab
Office: (519) 888-7465 79945
BlackBerry: (226) 220-4760


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Wayne Thayer
Sent: Tuesday, August 27, 2013 1:25 PM
To: [log in to unmask]
Subject: Re: [TN] Flip Chips

I forgot to mention that I have no nitrogen oven.  I am thinking of buying a rapid response hot plate and putting that inside of a big vacuum bell jar.  If I go through several vacuum purge cycles I should be able to get to 100ppm O2 in less than a half hour.  Anybody done that?  Recommendations for hot plates?  How about recommendations for O2 meters which go down to that level?

Wayne

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Wayne Thayer
Sent: Tuesday, August 27, 2013 1:00 PM
To: [log in to unmask]
Subject: [TN] Flip Chips

OK, Inge, you've inspired me to share what I'm up to presently:

I'm trying to prove out an in-house flip chip attach/underfill process.  I'll get the die from Practical Components and/or Topline, most likely 10mil pitch full array, although Practical also reps a PacTech 200x400 micron array which sounds pretty good too.  Looks like SnPb would be special order, so I'll do SAC305.

I'm disappointed to see that the boards they stock for these are all OSP, which means that in initial development anyway, that I'll have to cut the test board in sections.

Any advice from the "school of hard knocks" for me?  Preferred fluxes/underfills?  Good stories maybe?

Wayne

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge Hernefjord
Sent: Tuesday, August 27, 2013 12:47 PM
To: [log in to unmask]
Subject: Re: [TN] test

What is (not) going on?  No conversation. No problems. No fun stories.
Nothing at all. Technet's death-throes?

Inge


On 26 August 2013 15:26, Steven Creswick <[log in to unmask]> wrote:

> Ah, but here in the mid-west, the cicada's are rubbing their legs 
> together ...
>
> Steve C
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge Hernefjord
> Sent: Monday, August 26, 2013 6:21 PM
> To: [log in to unmask]
> Subject: [TN] test
>
> Silent as Nevada desert.
>
>
> ______________________________________________________________________
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