Can you detail the other components on the PCB assembly? from small to
biggest...
On Tue, Aug 27, 2013 at 8:38 PM, Joyce Koo <[log in to unmask]> wrote:
> Hmm, you are living dangerously. You do need good control to make sure it
> all melted at same time, unless it is very few C4s. you possibly looking
> at very aggressive flux since your reflow tool is not optimal. No
> recommendation here.
>
> Joyce Koo
> Researcher
> Materials Interconnect Lab
> Office: (519) 888-7465 79945
> BlackBerry: (226) 220-4760
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Wayne Thayer
> Sent: Tuesday, August 27, 2013 1:25 PM
> To: [log in to unmask]
> Subject: Re: [TN] Flip Chips
>
> I forgot to mention that I have no nitrogen oven. I am thinking of buying
> a rapid response hot plate and putting that inside of a big vacuum bell
> jar. If I go through several vacuum purge cycles I should be able to get
> to 100ppm O2 in less than a half hour. Anybody done that? Recommendations
> for hot plates? How about recommendations for O2 meters which go down to
> that level?
>
> Wayne
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Wayne Thayer
> Sent: Tuesday, August 27, 2013 1:00 PM
> To: [log in to unmask]
> Subject: [TN] Flip Chips
>
> OK, Inge, you've inspired me to share what I'm up to presently:
>
> I'm trying to prove out an in-house flip chip attach/underfill process.
> I'll get the die from Practical Components and/or Topline, most likely
> 10mil pitch full array, although Practical also reps a PacTech 200x400
> micron array which sounds pretty good too. Looks like SnPb would be
> special order, so I'll do SAC305.
>
> I'm disappointed to see that the boards they stock for these are all OSP,
> which means that in initial development anyway, that I'll have to cut the
> test board in sections.
>
> Any advice from the "school of hard knocks" for me? Preferred
> fluxes/underfills? Good stories maybe?
>
> Wayne
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge Hernefjord
> Sent: Tuesday, August 27, 2013 12:47 PM
> To: [log in to unmask]
> Subject: Re: [TN] test
>
> What is (not) going on? No conversation. No problems. No fun stories.
> Nothing at all. Technet's death-throes?
>
> Inge
>
>
> On 26 August 2013 15:26, Steven Creswick <[log in to unmask]>
> wrote:
>
> > Ah, but here in the mid-west, the cicada's are rubbing their legs
> > together ...
> >
> > Steve C
> >
> > -----Original Message-----
> > From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge Hernefjord
> > Sent: Monday, August 26, 2013 6:21 PM
> > To: [log in to unmask]
> > Subject: [TN] test
> >
> > Silent as Nevada desert.
> >
> >
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