OK, Inge, you've inspired me to share what I'm up to presently:

I'm trying to prove out an in-house flip chip attach/underfill process.  I'll get the die from Practical Components and/or Topline, most likely 10mil pitch full array, although Practical also reps a PacTech 200x400 micron array which sounds pretty good too.  Looks like SnPb would be special order, so I'll do SAC305.

I'm disappointed to see that the boards they stock for these are all OSP, which means that in initial development anyway, that I'll have to cut the test board in sections.

Any advice from the "school of hard knocks" for me?  Preferred fluxes/underfills?  Good stories maybe?

Wayne

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge Hernefjord
Sent: Tuesday, August 27, 2013 12:47 PM
To: [log in to unmask]
Subject: Re: [TN] test

What is (not) going on?  No conversation. No problems. No fun stories.
Nothing at all. Technet's death-throes?

Inge


On 26 August 2013 15:26, Steven Creswick <[log in to unmask]> wrote:

> Ah, but here in the mid-west, the cicada's are rubbing their legs 
> together ...
>
> Steve C
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge Hernefjord
> Sent: Monday, August 26, 2013 6:21 PM
> To: [log in to unmask]
> Subject: [TN] test
>
> Silent as Nevada desert.
>
>
> ______________________________________________________________________
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