Karl,
Do you really mean 0.5 inches?

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----- Original Message -----
From: karl sauter [[log in to unmask]]
Sent: 08/13/2013 02:38 PM MST
To: <[log in to unmask]>
Subject: Re: [IPC-600-6012] Wicking Requirement IPC 6012B/3A vs 6013C/3A



Pete,

Would be good to have crossection slightly micro-etched in order to show 
the demarcation between inner layer foil and PTH plated copper at the 
interconnect.  Then can distinguish between extent of etchback from 
extent of Cu wicking.

Etchback of more than 0.5 inches suggests excessive and/or non-uniform 
desmear.

Regards,
Karl Sauter
Oracle Corporation


On 8/13/2013 2:19 PM, Pete Menuez wrote:
> Hello All -
>   
> This isn't the best picture but it is all I have.
>   
> This cross section is being evaluated to IPC 6012 Rev B Class 3A and is
> being rejected for wicking in excess 2 mils.  Is this, in you all's
> opinion, wicking or is this the effect of plasma etch/resin
> removal/glass etch and not wicking?  How should this be evaluated under
> B/3A?
>   
> How would this be evaluated in 6012 Rev C Class 3A?  Could you even
> evaluate it since this is before etch?
>   
> Comments are greatly appreciated.  Btw, I'm not trying to save anything.
> This panel has already been scrapped out - I have a presentation with my
> customer and I'd like to offer more opinion than just my own and the
> board fab.
>   
>   
> Thanks,
> Pete
>   
>   
>   
>   
>   
>   
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> Peter Menuez
> Supplier Quality Engineering Manager
> L-3 Communications Cincinnati Electronics
> 7500 Innovation Way
> Mason, Ohio 45040
> [log in to unmask] <mailto:[log in to unmask]>
> 513-573-6401 Voice
> 513-767-3778 Cell
>   
>   
>
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