Hi Joyce,
Thanks for reply
Lyon Yuan
-----Original Message-----
From: Joyce Koo [mailto:[log in to unmask]]
Sent: Monday, July 15, 2013 10:24 PM
To: 'TechNet E-Mail Forum'; 'Lyon Yuan'
Subject: RE: [TN] What are all the probable causes of non-wetting for OSP
board test pads when the circuit boards are run through our reflow
Oxidation.
Joyce Koo
Researcher
Materials Interconnect Lab
Office: (519) 888-7465 79945
BlackBerry: (226) 220-4760
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Lyon Yuan
Sent: Monday, July 15, 2013 10:15 AM
To: [log in to unmask]
Subject: Re: [TN] What are all the probable causes of non-wetting for OSP
board test pads when the circuit boards are run through our reflow
Hi Victor,
I apply some flux on non-wetting test pads and reflow again. The solder is
good. It made me confused.
Lyon Yuan
-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]] On Behalf Of
Victor Hernandez
Sent: Monday, July 15, 2013 10:01 PM
To: [log in to unmask]
Subject: Re: [TN] What are all the probable causes of non-wetting for OSP
board test pads when the circuit boards are run through our reflow
Contaminate by solder mask process?
Thickness of OSP?
Victor,
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Brian Ellis
Sent: Monday, July 15, 2013 8:35 AM
To: [log in to unmask]
Subject: Re: [TN] What are all the probable causes of non-wetting for OSP
board test pads when the circuit boards are run through our reflow
In order, the most probable first:
- the underlying copper has not been correctly cleaned before applying the
OSP
- the underlying copper has been brushed, pumiced or otherwise treated with
an abrasive
- the underlying copper, if electrolytic, has been deposited from a badly
controlled/filtered solution, causing co-deposits of organic additives or
simply particulate contamination
- your OSP has passed its sell-by date
Brian
On 15.07.2013 14:19, Lyon Yuan wrote:
> Hi All,
> What are all the probable causes of non-wetting for OSP board test
> pads when the circuit boards are run through reflow?
>
> Lyon Yuan
> ______________________________________________________________________
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