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July 2013

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Subject:
From:
Lyon Yuan <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Lyon Yuan <[log in to unmask]>
Date:
Mon, 15 Jul 2013 22:03:13 +0800
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Hi All,

What's the recommended flux apply on Sn100C of AIM?

Lyon Yuan


-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]] On Behalf Of Brian Ellis
Sent: Monday, July 15, 2013 9:35 PM
To: [log in to unmask]
Subject: Re: [TN] What are all the probable causes of non-wetting for OSP board test pads when the circuit boards are run through our reflow

In order, the most probable first:
- the underlying copper has not been correctly cleaned before applying the OSP
- the underlying copper has been brushed, pumiced or otherwise treated with an abrasive
- the underlying copper, if electrolytic, has been deposited from a badly controlled/filtered solution, causing co-deposits of organic additives or simply particulate contamination
- your OSP has passed its sell-by date

Brian

On 15.07.2013 14:19, Lyon Yuan wrote:
> Hi All,
>
>
>
>
>
> What are all the probable causes of non-wetting for OSP board test 
> pads when the circuit boards are run through reflow?
>
>
>
>
>
>
>
> Lyon Yuan
>
>
>
>
>
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