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July 2013

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Subject:
From:
Victor Hernandez <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Mon, 15 Jul 2013 09:01:13 -0500
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Contaminate by solder mask process?
Thickness of OSP?

Victor,

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Brian Ellis
Sent: Monday, July 15, 2013 8:35 AM
To: [log in to unmask]
Subject: Re: [TN] What are all the probable causes of non-wetting for OSP board test pads when the circuit boards are run through our reflow

In order, the most probable first:
- the underlying copper has not been correctly cleaned before applying the OSP
- the underlying copper has been brushed, pumiced or otherwise treated with an abrasive
- the underlying copper, if electrolytic, has been deposited from a badly controlled/filtered solution, causing co-deposits of organic additives or simply particulate contamination
- your OSP has passed its sell-by date

Brian

On 15.07.2013 14:19, Lyon Yuan wrote:
> Hi All,

> What are all the probable causes of non-wetting for OSP board test 
> pads when the circuit boards are run through reflow?
>
> Lyon Yuan
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