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July 2013

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Subject:
From:
Inge Hernefjord <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Inge Hernefjord <[log in to unmask]>
Date:
Mon, 15 Jul 2013 14:47:59 +0200
Content-Type:
text/plain
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text/plain (43 lines)
Missing OSP .

My two euros

Inge


On 15 July 2013 13:19, Lyon Yuan <[log in to unmask]> wrote:

> Hi All,
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> What are all the probable causes of non-wetting for OSP board test pads
> when
> the circuit boards are run through reflow?
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> Lyon Yuan
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