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Subject:
From:
Torsten Hagge <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Torsten Hagge <[log in to unmask]>
Date:
Wed, 10 Jul 2013 12:13:24 +0000
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Hi Reuven,

standard is 2mm (stress value around 300..500µm/m), OEM requirement is 5mm.

Torsten

Von: Reuven Rokah [mailto:[log in to unmask]]
Gesendet: Mittwoch, 10. Juli 2013 12:15
An: TechNet E-Mail Forum; Torsten Hagge
Betreff: Re: [TN] AW: [TN] AW: Best Practice Question - Depanelizing

Hi Torsten,

What is the keepout area you need to give guaranty of zero cracks in ceramic / glass components?
Thanks
Reuven
On Wed, Jul 10, 2013 at 12:54 PM, Torsten Hagge <[log in to unmask]<mailto:[log in to unmask]>> wrote:
Hi Joyce,

the punch machine uses two knifes of 5mm, these are chamfered only at one side, so that the punch force is driven into the panel frame. The punch machine has top and bottom tool, which are punched by 8 tons to zero. So each PWB design need his own tool set (around 5k€), the machine is about 15k€.

The board strap size is 1 to 3mm, the punch process can be optimized by milling 0.3mm into the board so that the knifes only hit the strap and not the board edge. You can improve knife live by additional drillings into the strap design.

We use this for standard FR4 up to 6 layer and 2,4mm thickness, the vendor shows 2mm Al IMS cutted... (http://www.dieter-metz.de/unser-trennverfahren)

Torsten



Mit freundlichen Grüßen

KRISTRONICS GmbH
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-----Ursprüngliche Nachricht-----
Von: Joyce Koo [mailto:[log in to unmask]<mailto:[log in to unmask]>]
Gesendet: Mittwoch, 10. Juli 2013 11:27
An: [log in to unmask]<mailto:[log in to unmask]>; Torsten Hagge
Betreff: Re: [TN] AW: Best Practice Question - Depanelizing

Torsten, can you comment on the size and shape of the punch process?  Any stack up limitation?
--------------------------
Sent using BlackBerry


----- Original Message -----
From: Torsten Hagge [mailto:[log in to unmask]<mailto:[log in to unmask]>]
Sent: Wednesday, July 10, 2013 03:09 AM
To: [log in to unmask]<mailto:[log in to unmask]> <[log in to unmask]<mailto:[log in to unmask]>>
Subject: [TN] AW: Best Practice Question - Depanelizing

Hi Phil,

punch process with good knife design give very good results with  less than 500µm/m, is best practice for several automotive OEM.

Our tools are qualified by Audi, Daimler, Ford, GM, Nissan, Renault, Porsche, VW.

VW/Porsche requirement is less 500µm/m for complete PWB process (printer, placement, oven, AOI, ICT, depaneling & EOL-test)...

Torsten

Best Regards

KRISTRONICS GmbH
Torsten Hagge
team leader HW development &
tech. projectmanager
Gewerbegrund 5-9
24955 Harrislee
Telefon +49 (0) 461 7741-624<tel:%2B49%20%280%29%20461%207741-624>
Telefax +49 (0) 461 7741-642<tel:%2B49%20%280%29%20461%207741-642>
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-----Ursprüngliche Nachricht-----
Von: TechNet [mailto:[log in to unmask]<mailto:[log in to unmask]>] Im Auftrag von Phil Bavaro
Gesendet: Mittwoch, 10. Juli 2013 01:51
An: [log in to unmask]<mailto:[log in to unmask]>
Betreff: [TN] Best Practice Question - Depanelizing

I have been asked to determine what the best practice is for depaneling PWAs from an array (more than one PWA per panel run down the assembly line), or in other words...

....how should we be depanelizing PWAs, a) v-score, b) pin router, or c) mouse bite/punch.

I do have a personal opinion (listed below), but my experience was with commercial Class 2 and not Hi-rel Class 3 hardware.  I am looking for input from others that have years of experience in the Hi-rel arena:

a) V-scoring was always the easiest but required that the score go all the way across the panel.  The result was that there were a few glass bundles (.012" approx) which were sheared left over while the area of the v-score was smoothly finished by the original router.  The mechanical stress, if performed using the round blade to shear while supporting the v-score from the bottom, in minimal.  The solder joints keep away is a minimum of .080" away from the top edge of the V, but ceramic caps might need further distances and special orientation.  Proper singulation method is important so this is not a high volume production type method.  I have always discouraged jump scoring.

b) The pin router method results in a nicely milled edge but it requires ESD controls (ionized air) as well as excellent FOD controls (vacuum for the dust) to control the process.  The resultant board edge is identical to what a PWB fabricator would supply and one advantage is that the copper to board edge pull back area is less than with a v-score.  We don't have room for tooling pins to hold the boards so vacuum hold down is a requirement and that applies mechanical stress to the PWA as well.  This method is suited well to high volume.

c) The mouse bite punch method leaves the entire board edge thickness exposed for glass bundles and is the least desired due to this.  If the mouse bites are not spaced optimally, the punch or nipping process can impart the highest stresses of all of these methods.  The edge copper pull back is from the edge of the mouse bite holes which is close to the amount needed for v-scoring.  The other drawback is that some people tend to want to flex the mouse bites to failure and that causes unknown but excessive stresses.

Please feel free to respond with your preferences as well as point out any disagreements you might have given that this process needs to be used with hi-rel hardware (non-space, but definitely airborne).


Thanks in advance,

Phil
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