Hi Torsten,
What is the keepout area you need to give guaranty of zero cracks in
ceramic / glass components?
Thanks
Reuven
On Wed, Jul 10, 2013 at 12:54 PM, Torsten Hagge <
[log in to unmask]> wrote:
> Hi Joyce,
>
> the punch machine uses two knifes of 5mm, these are chamfered only at one
> side, so that the punch force is driven into the panel frame. The punch
> machine has top and bottom tool, which are punched by 8 tons to zero. So
> each PWB design need his own tool set (around 5k€), the machine is about
> 15k€.
>
> The board strap size is 1 to 3mm, the punch process can be optimized by
> milling 0.3mm into the board so that the knifes only hit the strap and not
> the board edge. You can improve knife live by additional drillings into the
> strap design.
>
> We use this for standard FR4 up to 6 layer and 2,4mm thickness, the vendor
> shows 2mm Al IMS cutted... (http://www.dieter-metz.de/unser-trennverfahren
> )
>
> Torsten
>
>
>
> Mit freundlichen Grüßen
>
> KRISTRONICS GmbH
> i.A. Torsten Hagge
> Gruppenleiter HW Entwicklung
> Gewerbegrund 5-9
> 24955 Harrislee
> Telefon +49 (0) 461 7741-624
> Telefax +49 (0) 461 7741-642
> [log in to unmask]
> www.kristronics.de
> Gerichtsstand Flensburg, Handelsregister: HRB 1433 FL
> Geschäftsführer Dipl.-Ing. oec. Thormod Ohm
> Ust-Id-Nr. DE 811182059
> Bankverbindung: Deutsche Bank AG Flensburg, Konto-Nr. 4216610, BLZ 21570011
> IBAN: DE32 2157 0011 0421 6610 00, BIC: DEUT DE HH 215
> Bitte prüfen Sie der Umwelt zuliebe, ob der Ausdruck dieser Mail
> wirklich erforderlich ist.
>
>
>
> -----Ursprüngliche Nachricht-----
> Von: Joyce Koo [mailto:[log in to unmask]]
> Gesendet: Mittwoch, 10. Juli 2013 11:27
> An: [log in to unmask]; Torsten Hagge
> Betreff: Re: [TN] AW: Best Practice Question - Depanelizing
>
> Torsten, can you comment on the size and shape of the punch process? Any
> stack up limitation?
> --------------------------
> Sent using BlackBerry
>
>
> ----- Original Message -----
> From: Torsten Hagge [mailto:[log in to unmask]]
> Sent: Wednesday, July 10, 2013 03:09 AM
> To: [log in to unmask] <[log in to unmask]>
> Subject: [TN] AW: Best Practice Question - Depanelizing
>
> Hi Phil,
>
> punch process with good knife design give very good results with less
> than 500µm/m, is best practice for several automotive OEM.
>
> Our tools are qualified by Audi, Daimler, Ford, GM, Nissan, Renault,
> Porsche, VW.
>
> VW/Porsche requirement is less 500µm/m for complete PWB process (printer,
> placement, oven, AOI, ICT, depaneling & EOL-test)...
>
> Torsten
>
> Best Regards
>
> KRISTRONICS GmbH
> Torsten Hagge
> team leader HW development &
> tech. projectmanager
> Gewerbegrund 5-9
> 24955 Harrislee
> Telefon +49 (0) 461 7741-624
> Telefax +49 (0) 461 7741-642
> [log in to unmask]
> www.kristronics.de
> Place of jurisdiction: Flensburg, commercial register: HRB 1433 FL CEO
> Dipl.-Ing. oec. Thormod Ohm VAD-Id DE 811182059 Bank account: Deutsche Bank
> AG Flensburg, account 4216610, bank number 21570011
> IBAN: DE32 2157 0011 0421 6610 00, BIC: DEUT DE HH 215 P Please consider
> the environment before printing this e-mail
>
>
>
>
> -----Ursprüngliche Nachricht-----
> Von: TechNet [mailto:[log in to unmask]] Im Auftrag von Phil Bavaro
> Gesendet: Mittwoch, 10. Juli 2013 01:51
> An: [log in to unmask]
> Betreff: [TN] Best Practice Question - Depanelizing
>
> I have been asked to determine what the best practice is for depaneling
> PWAs from an array (more than one PWA per panel run down the assembly
> line), or in other words...
>
> ....how should we be depanelizing PWAs, a) v-score, b) pin router, or c)
> mouse bite/punch.
>
> I do have a personal opinion (listed below), but my experience was with
> commercial Class 2 and not Hi-rel Class 3 hardware. I am looking for input
> from others that have years of experience in the Hi-rel arena:
>
> a) V-scoring was always the easiest but required that the score go all the
> way across the panel. The result was that there were a few glass bundles
> (.012" approx) which were sheared left over while the area of the v-score
> was smoothly finished by the original router. The mechanical stress, if
> performed using the round blade to shear while supporting the v-score from
> the bottom, in minimal. The solder joints keep away is a minimum of .080"
> away from the top edge of the V, but ceramic caps might need further
> distances and special orientation. Proper singulation method is important
> so this is not a high volume production type method. I have always
> discouraged jump scoring.
>
> b) The pin router method results in a nicely milled edge but it requires
> ESD controls (ionized air) as well as excellent FOD controls (vacuum for
> the dust) to control the process. The resultant board edge is identical to
> what a PWB fabricator would supply and one advantage is that the copper to
> board edge pull back area is less than with a v-score. We don't have room
> for tooling pins to hold the boards so vacuum hold down is a requirement
> and that applies mechanical stress to the PWA as well. This method is
> suited well to high volume.
>
> c) The mouse bite punch method leaves the entire board edge thickness
> exposed for glass bundles and is the least desired due to this. If the
> mouse bites are not spaced optimally, the punch or nipping process can
> impart the highest stresses of all of these methods. The edge copper pull
> back is from the edge of the mouse bite holes which is close to the amount
> needed for v-scoring. The other drawback is that some people tend to want
> to flex the mouse bites to failure and that causes unknown but excessive
> stresses.
>
> Please feel free to respond with your preferences as well as point out any
> disagreements you might have given that this process needs to be used with
> hi-rel hardware (non-space, but definitely airborne).
>
>
> Thanks in advance,
>
> Phil
> ________________________________
> This message and any attachments are solely for the use of the addressee
> and may contain L-3 proprietary information that may also be defined as USG
> export controlled technical data. If you are not the intended recipient,
> any disclosure, use or distribution of its content is prohibited. Please
> notify the sender by reply e-mail and immediately delete this message and
> any attachments.
>
> ______________________________________________________________________
> This email has been scanned by the Symantec Email Security.cloud service.
> For more information please contact helpdesk at x2960 or [log in to unmask]
>
> ______________________________________________________________________
> This email has been scanned by the Symantec Email Security.cloud service.
> For more information please contact helpdesk at x2960 or [log in to unmask]
> ______________________________________________________________________
>
> ---------------------------------------------------------------------
> This transmission (including any attachments) may contain confidential
> information, privileged material (including material protected by the
> solicitor-client or other applicable privileges), or constitute non-public
> information. Any use of this information by anyone other than the intended
> recipient is prohibited. If you have received this transmission in error,
> please immediately reply to the sender and delete this information from
> your system. Use, dissemination, distribution, or reproduction of this
> transmission by unintended recipients is not authorized and may be unlawful.
>
> ______________________________________________________________________
> This email has been scanned by the Symantec Email Security.cloud service.
> For more information please contact helpdesk at x2960 or [log in to unmask]
> ______________________________________________________________________
>
--
Best Regards,
*Reuven Rokah*
Mobile: 972-52-6012018
Tel: 972-3-9360688
Fax: 076-5100674
<http://www.rokah-technologies.com/>[log in to unmask]
[log in to unmask]
www.rokah-technologies.com
**
This e-mail message is intended for the recipient only and contains
information which is CONFIDENTIAL and which may be proprietary of Rokah
Technologies. If you have received this transmission in error, please
inform me by e-mail, phone or fax, and then please delete all of the
original files and all other copies exist.
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
|
