I agree, it's most probably what I like to think of as "A case of Clean Room
Fly"!
I explain: Many years ago a customer returned a roll of "Nitto" tape very
upset because it had a fly embedded in it. Although it was impossible, it
had happened, but also because it was impossible there was nothing to
investigate, though we did and found nothing.
Best Wishes
Mike
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kerr, Bryan (UK)
Sent: Wednesday, July 31, 2013 8:04 AM
To: [log in to unmask]
Subject: Re: [TN] Singular 30% Void and Oversize Ball Diameter
Hi Leland
Seems like a random event to me if you are running thousands of boards a
day. Even a minute trace of some volatile material on the ball or PEC pad
could cause this. Perhaps not worth losing sleep over and put it in the
memory banks !
Regards
Bryan Kerr
Principal Quality Engineer
CMA Lab and Process Engineering
BAE Systems Maritime Services
Manufacturing Hillend
Hillend Industrial Estate
Hillend
Nr Dunfermline
Fife
Scotland
KY11 9HQ
01383-836097
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Leland Woodall
Sent: 30 July 2013 19:18
To: [log in to unmask]
Subject: [TN] Singular 30% Void and Oversize Ball Diameter
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Folks,
We run thousands of boards a day, and almost every one carries a BGA. We
inspect each with inline X-ray.
Last week, we had one single ball to fail for a 30% void and an oversize
diameter. We contacted the supplier, and they said their process was
incapable of sending out such a defect.
We've never had a void over 5%, and even those are incredibly rare.
What within our process might have caused this, and do you agree with the
statement of the supplier? How do you recommend we analyze the failure?
Thanks in advance for your help!
Leland
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