Hi Leland

Seems like a random event to me if you are running thousands of boards a day. Even a minute trace of some volatile material on the ball or PEC pad could cause this. Perhaps not worth losing sleep over and put it in the memory banks !

Regards


Bryan Kerr
Principal Quality Engineer
CMA Lab and Process Engineering
BAE Systems Maritime Services
Manufacturing Hillend
Hillend Industrial Estate
Hillend
Nr Dunfermline
Fife
Scotland
KY11 9HQ
01383-836097


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Leland Woodall
Sent: 30 July 2013 19:18
To: [log in to unmask]
Subject: [TN] Singular 30% Void and Oversize Ball Diameter

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Folks,

We run thousands of boards a day, and almost every one carries a BGA.  We inspect each with inline X-ray.

Last week, we had one single ball to fail for a 30% void and an oversize diameter.  We contacted the supplier, and they said their process was incapable of sending out such a defect.

We've never had a void over 5%, and even those are incredibly rare.

What within our process might have caused this, and do you agree with the statement of the supplier?  How do you recommend we analyze the failure?

Thanks in advance for your help!

Leland

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