Folks,

We run thousands of boards a day, and almost every one carries a BGA.  We inspect each with inline X-ray.

Last week, we had one single ball to fail for a 30% void and an oversize diameter.  We contacted the supplier, and they said their process was incapable of sending out such a defect.

We've never had a void over 5%, and even those are incredibly rare.

What within our process might have caused this, and do you agree with the statement of the supplier?  How do you recommend we analyze the failure?

Thanks in advance for your help!

Leland

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