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July 2013

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Subject:
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Wed, 24 Jul 2013 12:18:25 +0000
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While not a soldering problem, what a lot of people are not aware of: humidity can cause major issues in conformal coating and epoxy adhesion. It is a much bigger factor than most people realize.
Also, blowholes in solder joints are caused by moisture both on the surface and inside the PWB.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
Sent: Tuesday, July 23, 2013 4:17 PM
To: [log in to unmask]
Subject: Re: [TN] Humidity Issues

Hi Blair - yes, in addition to controlling handling and packaging as you detailed, we also control the facility humidity levels to avoid soldering and ESD issues.

Dave Hillman
Rockwell Collins
[log in to unmask]



From:   Blair Hogg <[log in to unmask]>
To:     <[log in to unmask]>
Date:   07/23/2013 02:48 PM
Subject:        [TN] Humidity Issues
Sent by:        TechNet <[log in to unmask]>



Hi Technetters,

Been rummaging through the archives looking for info on humidity issues in soldering process, found some interesting info on why keeping boards sealed and if not, baking, is important to preclude delimination problems. 
Hoever what I was looking for seems to elude me. 

Assuming that boards are stored properly and are below the levels of moisture content that can cuase problems, and that MSDs are also stored per industry standards, what other issues does humidity induce in the sctual soldering process itself? If the humidity gets too high, even though a facility has air conditioning it may only control temperature and not humidity level, will this cause additional problems in the process itself? 

Thanks,

Blair




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