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July 2013

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From:
Wayne Thayer <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Wayne Thayer <[log in to unmask]>
Date:
Tue, 23 Jul 2013 20:06:17 +0000
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Hi Blair-

Too high humidity:  Increased corrosion, possible problems with flux/paste due to hydrolization (boards would basically have to be wet for this latter issue)

Too low humidity:  Static electricity.

Higher end shops try to control to be 50%+/-10%.  (I think they all specify +/-5%, but I haven't seen it achieved.)

Wayne

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Blair Hogg
Sent: Tuesday, July 23, 2013 3:48 PM
To: [log in to unmask]
Subject: [TN] Humidity Issues

Hi Technetters,

Been rummaging through the archives looking for info on humidity issues in soldering process, found some interesting info on why keeping boards sealed and if not, baking, is important to preclude delimination problems. Hoever what I was looking for seems to elude me. 

Assuming that boards are stored properly and are below the levels of moisture content that can cuase problems, and that MSDs are also stored per industry standards, what other issues does humidity induce in the sctual soldering process itself? If the humidity gets too high, even though a facility has air conditioning it may only control temperature and not humidity level, will this cause additional problems in the process itself? 

Thanks,

Blair

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