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Date: | Tue, 30 Jul 2013 13:25:14 -0500 |
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Hi Leland - I love the supplier's comment as the existence of the 30% void
demonstrates the statement to not be true. Was the 30% void an observation
or was it associated with an component failure? Do you have open microvias
in the pads? Also - the JSTD-001 committee is revising the BGA void
criteria to 30% based on a series of test results submitted to the
committee.
Dave
From: Leland Woodall <[log in to unmask]>
To: <[log in to unmask]>
Date: 07/30/2013 01:19 PM
Subject: [TN] Singular 30% Void and Oversize Ball Diameter
Sent by: TechNet <[log in to unmask]>
Folks,
We run thousands of boards a day, and almost every one carries a BGA. We
inspect each with inline X-ray.
Last week, we had one single ball to fail for a 30% void and an oversize
diameter. We contacted the supplier, and they said their process was
incapable of sending out such a defect.
We've never had a void over 5%, and even those are incredibly rare.
What within our process might have caused this, and do you agree with the
statement of the supplier? How do you recommend we analyze the failure?
Thanks in advance for your help!
Leland
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