In order, the most probable first:
- the underlying copper has not been correctly cleaned before applying
the OSP
- the underlying copper has been brushed, pumiced or otherwise treated
with an abrasive
- the underlying copper, if electrolytic, has been deposited from a
badly controlled/filtered solution, causing co-deposits of organic
additives or simply particulate contamination
- your OSP has passed its sell-by date
Brian
On 15.07.2013 14:19, Lyon Yuan wrote:
> Hi All,
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> What are all the probable causes of non-wetting for OSP board test pads when
> the circuit boards are run through reflow?
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> Lyon Yuan
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