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July 2013

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TechNet E-Mail Forum <[log in to unmask]>, Lyon Yuan <[log in to unmask]>
Date:
Mon, 15 Jul 2013 16:35:27 +0300
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TechNet E-Mail Forum <[log in to unmask]>, Brian Ellis <[log in to unmask]>
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Brian Ellis <[log in to unmask]>
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In order, the most probable first:
- the underlying copper has not been correctly cleaned before applying 
the OSP
- the underlying copper has been brushed, pumiced or otherwise treated 
with an abrasive
- the underlying copper, if electrolytic, has been deposited from a 
badly controlled/filtered solution, causing co-deposits of organic 
additives or simply particulate contamination
- your OSP has passed its sell-by date

Brian

On 15.07.2013 14:19, Lyon Yuan wrote:
> Hi All,
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> What are all the probable causes of non-wetting for OSP board test pads when
> the circuit boards are run through reflow?
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> Lyon Yuan
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