TECHNET Archives

June 2013

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Ed Popielarski <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ed Popielarski <[log in to unmask]>
Date:
Thu, 6 Jun 2013 20:53:59 +0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (123 lines)
It does not call that out in the drawing detail, so I would assume no.

Ed Popielarski
Engineering Manager


                               970 NE 21st Ct.
                              Oak Harbor, Wa. 98277

                              Ph: 360-675-1322
                              Fx: 206-624-0965
                              Cl: 949-581-6601

https://maps.google.com/maps/myplaces?hl=en&ll=48.315753,-122.643578&spn=0.011188,0.033023&ctz=420&t=m&z=16&iwloc=A


-----Original Message-----
From: Dwight Mattix [mailto:[log in to unmask]] 
Sent: Thursday, June 06, 2013 1:38 PM
To: TechNet E-Mail Forum; Ed Popielarski; [log in to unmask]
Subject: Re: [TN] Dewetting on high current connector

that tin finish fused after plating?

At 01:06 PM 6/6/2013, Ed Popielarski wrote:
>Phil,
>
>This is "new build" although not built by my company. They are 
>post-plated min. 40u" (1.02 microns) matte tin (lead free) over min.
>80 u" (2.04 microns) nickel. The tin plate over nickel is probably 
>reflowing during wave/selective/hand soldering to the PCB, but I don't 
>know this for certain as I've not observed it personally, only the end 
>result.
>
>Ed Popielarski
>Engineering Manager
>
>
>                                970 NE 21st Ct.
>                               Oak Harbor, Wa. 98277
>
>                               Ph: 360-675-1322
>                               Fx: 206-624-0965
>                               Cl: 949-581-6601
>
>https://maps.google.com/maps/myplaces?hl=en&ll=48.315753,-122.643578&sp
>n=0.011188,0.033023&ctz=420&t=m&z=16&iwloc=A
>
>
>-----Original Message-----
>From: [log in to unmask] [mailto:[log in to unmask]]
>Sent: Thursday, June 06, 2013 12:46 PM
>To: TechNet E-Mail Forum; Ed Popielarski
>Subject: RE: Dewetting on high current connector
>
>Hi Ed,
>
>Was this a solder coated blade connector?  Dewetting normally applies 
>to something that has been exposed to solder and I am not sure why a 
>connector would get a soft metal (solder) finish.  Is this a field 
>return (can't tell if I am seeing corrosion) or freshly produced item?
>
>Phil
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Ed Popielarski
>Sent: Thursday, June 06, 2013 12:00 PM
>To: [log in to unmask]
>Subject: [TN] Dewetting on high current connector
>
>Greetings fellow 'netters,
>
>I have discovered a dewetting condition on high current blade
>connector(s) which causes me to raise an eyebrow. I can't find any 
>scholarly articles discussing the long term effect such an irregular 
>surface at the material contact interface (photo located at 
>http://stevezeva.homestead.com/Terminal_de-wetting.JPG ) will have on 
>connection integrity at high current. This is an extreme environment 
>automotive application with MTBF expectations in excess of 10 years.
>
>Any guidance and/or professional opinions would be greatly appreciated.
>
>As always, thanks to Steve G. for sharing his webspace with us!
>
>Ed Popielarski
>Engineering Manager
>
>[Description: FullLogo]
>                                970 NE 21st Ct.
>                               Oak Harbor, Wa. 98277
>
>                               Ph: 360-675-1322
>                               Fx: 206-624-0965
>                               Cl: 949-581-6601
>
>https://maps.google.com/maps/myplaces?hl=en&ll=48.315753,-122.643578&sp
>n=0.011188,0.033023&ctz=420&t=m&z=16&iwloc=A
>
>
>______________________________________________________________________
>This email has been scanned by the Symantec Email Security.cloud service.
>For more information please contact helpdesk at x2960 or 
>[log in to unmask] 
>______________________________________________________________________
>________________________________
>  This message and any attachments are solely for the use of the  
>addressee and may contain L-3 proprietary information that may also  be 
>defined as USG export controlled technical data. If you are not  the 
>intended recipient, any disclosure, use or distribution of its  content 
>is prohibited. Please notify the sender by reply e-mail and  
>immediately delete this message and any attachments.
>
>______________________________________________________________________
>This email has been scanned by the Symantec Email Security.cloud service.
>For more information please contact helpdesk at x2960 or 
>[log in to unmask] 
>______________________________________________________________________

______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

ATOM RSS1 RSS2