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June 2013

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Subject:
From:
Inge Hernefjord <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Inge Hernefjord <[log in to unmask]>
Date:
Thu, 27 Jun 2013 16:59:23 -0700
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Bonjour Ioan,
ou BonBon?
Has Werner said so? I doubt. Well, as usual I do same as Dough does when he
has no answer, I open with 'It depends'. I mean that most anomalies sooner
or later end wth an open, even with less than 90%. Now, what do you offer
us? BGA-, SOIC-, DIL-, Connector- solder joints or what? And as Igor use to
trumpete 'dune yur hume lessun-cross section'  and send to us for optimal
discusson.

As it's Friday Tom Orrow, something may crack....

Inge


On 25 June 2013 05:34, Ioan Tempea <[log in to unmask]> wrote:

> Dear Technos,
>
> I remember Werner stating that an open circuit will appear if the crack
> covers 90% of the joint (or via hole circumference), so even if we have
> about 10% of unbroken contact. Is there any written evidence of that?
>
> Thanks,
>
> Ioan Tempea, ing.
> Ingénieur de fabrication / Manufacturing Engineer
> [cid:[log in to unmask]]
> 514-457-2150 #3556
>
>
>
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