Agreed. That's why I specified the. Type and location :-)
Regards,
Vladimir
SENTEC Testing Laboratory Inc.
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (647) 495-8727
Cell: (416) 899-1882
www.sentec.ca
-----Original Message-----
From: [log in to unmask]
Date: Tue, 25 Jun 2013 09:19:43
To: <[log in to unmask]>; <[log in to unmask]>
Subject: RE: [TN] Open event
I'll throw out the standard it depends as well. The type of solder joint also comes into play, as the crack propagates the impedance of the connection increases and could have a greater affect on RF performance, more so than a digital line.
Jim Carlson
Quality/Configuration Manager
L-3 Communications
Applied Signal & Image Technology
443-457-1111 Ext. 238
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Vladimir Igoshev
Sent: Tuesday, June 25, 2013 9:09 AM
To: [log in to unmask]
Subject: Re: [TN] Open event
Hi Ioan,
If I'm not mistaken, IBM had done some work (around 10 years ago) showing that the resistance of a flip chip solder joint starts changing only if more than 90% of the joint I'd cracked at an interface.
Regards,
Vladimir
SENTEC Testing Laboratory Inc.
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (647) 495-8727
Cell: (416) 899-1882
www.sentec.ca
-----Original Message-----
From: Ioan Tempea <[log in to unmask]>
Sender: TechNet <[log in to unmask]>
Date: Tue, 25 Jun 2013 08:34:09
To: <[log in to unmask]>
Reply-To: TechNet E-Mail Forum <[log in to unmask]>,
Ioan Tempea
<[log in to unmask]>
Subject: [TN] Open event
Dear Technos,
I remember Werner stating that an open circuit will appear if the crack covers 90% of the joint (or via hole circumference), so even if we have about 10% of unbroken contact. Is there any written evidence of that?
Thanks,
Ioan Tempea, ing.
Ingénieur de fabrication / Manufacturing Engineer [cid:[log in to unmask]]
514-457-2150 #3556
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