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June 2013

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Subject:
From:
Vladimir Igoshev <[log in to unmask]>
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Date:
Tue, 25 Jun 2013 13:08:42 +0000
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Hi Ioan,

If I'm not mistaken, IBM had done some work (around 10 years ago) showing that the resistance of a flip chip solder joint starts changing only if more than 90% of the joint I'd cracked at an interface.
Regards,

Vladimir

SENTEC Testing Laboratory Inc.
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (647) 495-8727
Cell: (416) 899-1882
www.sentec.ca

-----Original Message-----
From: Ioan Tempea <[log in to unmask]>
Sender: TechNet <[log in to unmask]>
Date: Tue, 25 Jun 2013 08:34:09 
To: <[log in to unmask]>
Reply-To: TechNet E-Mail Forum <[log in to unmask]>,
        Ioan Tempea
	<[log in to unmask]>
Subject: [TN] Open event

Dear Technos,

I remember Werner stating that an open circuit will appear if the crack covers 90% of the joint (or via hole circumference), so even if we have about 10% of unbroken contact. Is there any written evidence of that?

Thanks,

Ioan Tempea, ing.
Ingénieur de fabrication / Manufacturing Engineer
[cid:[log in to unmask]]
514-457-2150 #3556



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