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June 2013

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From:
"David D. Hillman" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 19 Jun 2013 11:23:09 -0500
Content-Type:
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Hi Wayne - yes, granted the NASA study isn't on a printed circuit board 
with various component configurations which would be really nice to have 
as a data set but still, the testing is one of the longest running data 
sets looking at long term tin whisker growth kinetics. Tin Whisker testing 
can be very complicated in terms of having controls which behave and are 
representative of product situations which is one reason the industry 
struggles with understanding tin whiskers. Lots of very good work 
currently in progress and most of that work will produce only small 
incremental gains but they will still be gains.  I know its frustrating 
but the industry will be able to better understand the tin whisker 
phenomenon as we gain more knowledge and then develop better 
mitigation/resolution solutions. There will always be various failure 
modes we fight on assemblies and tin whiskers are just the next one in 
line to be tackled.


Dave



From:   Wayne Thayer <[log in to unmask]>
To:     <[log in to unmask]>
Date:   06/17/2013 11:56 AM
Subject:        Re: [TN] minimum thickness of Type UR Conformal coat and 
tin whiskers
Sent by:        TechNet <[log in to unmask]>



Hi Dave-

If the NASA study referred to isn't a bunch more than the previously noted 
urethane delamination from tin plating "as a feature" study, then it 
doesn't deserve mention in the context of selecting a conformal coat 
thickness:  That reference is only about tin whisker growth on tin plated 
brass, with no conductors to short out and no dielectric, soldermask, or 
flux residue to alter the adhesion equation.

Dave, this is what was referred to before:

http://nepp.nasa.gov/whisker/reference/tech_papers/2010-Panashchenko-IPC-Tin-Whisker.pdf


If you have some NASA paper with more appropriate context to actual 
printed circuit boards, could you please reference them?

Wayne

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
Sent: Monday, June 17, 2013 11:02 AM
To: [log in to unmask]
Subject: Re: [TN] minimum thickness of Type UR Conformal coat and tin 
whiskers

Hi gang - sorry for the late reply but as Doug detailed, I was enjoying 
the SE US whitewater for the last week. As for tin whiskers and conformal 
coating mitigation, a conformal coating material captures and contains tin 
whiskers but does not eliminate them. There currently is some 
investigative work in progress under the SERDP organization contracts by 
Celestica/BAE and Rockwell Collins which will provide some insight on how 
conformal coating can alter the tin surface interface reactions thus 
impact tin whisker initiation/growth. The 4 mil thickness value that Phil 
mentioned is from the IPC JSTD 001E Space Addendum criteria and is based 
on a 12+ year ongoing investigation by NASA Goddard with a urathane 
conformal coating material. There is no consensus on what is the minimum 
thickness necessary for tin whisker risk mitigation by a conformal coating 
material yet -  although the published data does show thicker is better. 
There is also an IPC JSTD 001 task group working on a "State of the 
Industry" conformal coating  assessment effort that is ongoing right now 
which should provide the industry a baseline of typical coverage/thickness 
for various conformal coating materials types/application methods. This 
baseline could be used in an effort to develop what conformal coating 
minimum thickness would be adequate for tin whisker risk mitigation. So 
the short answer for Phil's question is there is a flurry of industry 
activity trying to provide an answer to his question. Good information 
takes time.

Dave Hillman
Rockwell Collins
[log in to unmask]



From:   Douglas Pauls <[log in to unmask]>
To:     <[log in to unmask]>
Date:   06/12/2013 08:12 AM
Subject:        Re: [TN] minimum thickness of Type UR Conformal coat and 
tin whiskers
Sent by:        TechNet <[log in to unmask]>



Phil,
While this is an answer I "should" know, I don't.  Dave Hillman regularly 
attends and presents at the CALCE yearly conference on whiskers and so he 
keeps up on all of that.  At present, my esteemed colleague is bumping his 


head on rocks, kayaking upside down, on some white water in North 
Carolina.  He should be back in the office on Monday and will no doubt 
answer then.

From our discussions, the general rule is still "no conformal coating 
prevents whiskers".  A thicker coating may cause the whisker to expend 
more energy punching through and yet more energy to punch through an 
adjacent coating on a lead (usually resulting in buckling), but I have yet 


to hear about some magic thickness of any kind of coating that completely 
mitigates whiskers.  But I could be wrong.

Dave?

Doug Pauls



From:   Phil Bavaro <[log in to unmask]>
To:     <[log in to unmask]>
Date:   06/11/2013 02:26 PM
Subject:        [TN] minimum thickness of Type UR Conformal coat and tin 
whiskers
Sent by:        TechNet <[log in to unmask]>



Doug et al,

Is there a disagreement in the industry as to what minimum thickness of 
urethane is required in order to mitigate tin whisker concerns?

I am hearing that the .003+/-.002" does not provide enough of a minimum 
thickness and that the number is as high as .004".   I can understand 
wanting the minimum being raised to .002" but higher than that would seem 
to make the process much more difficult to control.

I have a potential customer asking if we measure the thickness on the 
individual component leads which is another can of worms it seems.  We 
always used flat samples to document our thicknesses.

I did not get to attend this years APEX so I might have missed the latest 
data.
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