TECHNET Archives

June 2013

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Inge Hernefjord <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Inge Hernefjord <[log in to unmask]>
Date:
Wed, 5 Jun 2013 06:31:37 +0200
Content-Type:
text/plain
Parts/Attachments:
text/plain (13 lines)
A rather interesting paper from HP (Bulwith): " Intermetallic growth impact
on BGA Leadfree solder joints"
Dropbox/Soldering.....
Dropbox/BGA..

Inge


______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

ATOM RSS1 RSS2