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June 2013

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Subject:
From:
Bob Wettermann <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Bob Wettermann <[log in to unmask]>
Date:
Wed, 19 Jun 2013 06:32:18 -0500
Content-Type:
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Dear TechNetters:

Most of the epoxy underfills on all of our handheld devices are not
practically reworkable, even if you believe the marketing hype on
reworkable underfills. The adhesive force of the underfill either damages
the pads upon device removal, the mask is damaged during the "scrape off"
process. the chemical antidotes sold by the same underfill vendors either
damages nearby parts or is highly caustic to employees.

Has anyone approached this rework challenge differently or could conjure up
a unique way to suggest trying?

Thanks!

Bob W


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