Agree, have been in the MCM/Hybrid business for 40 years! Cut the red 1 sq
meter films by hand! Mixed our own silver glue. Modified first bonding
machine from K&S. Lots of problems with hand soldering (sealing) metal
covers to base. Vibration chipouts in silicon semis. And lots more. My
paranoya: bond lifts caused by too much frit glass on thickfilm conductors.
Still hate gold wire rupture in autobonders. And still hate to see a 0.1
gram wire among 100 7grams.

Inge


On 13 June 2013 22:37, Wayne Thayer <[log in to unmask]> wrote:

> Paranoia.  When you do lots of wirebonding you will do almost anything to
> assure there is nothing in the way of making a good weld.  Die from wafer
> fab should be OK, but did any die attach outgassing byproducts deposit on
> the wirebond pads?  And sometimes we have to do SMT prior to wirebond--hard
> to imagine a more filthy process!
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
> Sent: Thursday, June 13, 2013 4:27 PM
> To: [log in to unmask]
> Subject: Re: [TN] Dropbox
>
> On board there are many bare dies nowadays. - I guess.
> --------------------------
> Sent using BlackBerry
>
>
> ----- Original Message -----
> From: Inge Hernefjord [mailto:[log in to unmask]]
> Sent: Thursday, June 13, 2013 04:19 PM
> To: [log in to unmask] <[log in to unmask]>
> Subject: Re: [TN] Dropbox
>
> Wayne, why on earth (not SPACE) did you UV clean bare chips?
>
> Inge
>
>
> On 13 June 2013 22:14, Wayne Thayer <[log in to unmask]> wrote:
>
> > I've been "burned" by UV/Ozone cleaning of bare die which have FLASH
> > or EEPROM.  When they make these, it is common for the manufacturer to
> > put a device code in this space and/or store a table of "bad sectors".
> > Too much UV erased the memory, so programmers don't know how to program
> the parts.
> >
> > -----Original Message-----
> > From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
> > Sent: Thursday, June 13, 2013 2:03 PM
> > To: [log in to unmask]
> > Subject: Re: [TN] Dropbox
> >
> > Thx. Would be interested to know any CSP, flipchip, etc.
> > --------------------------
> > Sent using BlackBerry
> >
> >
> > From: Inge Hernefjord [mailto:[log in to unmask]]
> > Sent: Thursday, June 13, 2013 01:59 PM
> > To: TechNet E-Mail Forum <[log in to unmask]>; Steven Creswick <
> > [log in to unmask]>; Joyce Koo
> > Subject: Re: [TN] Dropbox
> >
> > Hi, genious duo,
> >
> > I had an old US Army report that emphasizes a lot about irradiation of
> > semiconductors. Now, you have to make a distinction between cleaning
> > semiconductors and expose them to natural irradiation as ready  products.
> >  UV/O2 is a outstanding method of cleaning any substrates, inclusive
> > semiconductor wafers of all kinds, because you get a cleanliness on
> > molecular level. And under controlled processes, the method does not
> > cause any harm to the target.
> >
> > About semi packages and irradiation, I understand what Juice aim at,
> > namely a exposure to high energy partikels or photons or phonons at
> > such a intensity level that you exceed the band gap levels ,  equal to
> > a memory I/O status shift.  I believe modern packages and semis are
> > radiation hardened for critical applications like for SPACE and
> > others. If you, of some reason, want to clean assembled boards by
> > means of UV/Ozone, nothing will happen.
> >
> > You can take part of the report under 'Cleaning' and the title is
> > 'UV-Ozone Cleaning of Semiconductor Surfaces'.
> >
> > Steve, you are welcome to add your antique papers to Dropbox. As I
> > said, most was evaluated decades ago.
> >
> > Inge
> >
> >
> > On 13 June 2013 17:28, Steven Creswick <[log in to unmask]
> <mailto:
> > [log in to unmask]>> wrote:
> > Joyce,
> >
> > I am going to send a couple old papers on plasma cleaning to Inge to
> > see if he will incorporate them into his drop box.  They are both 1989
> > vintage, essentially back in the olden days of plasma cleaning, so may
> > be of little specific use, other than generics.
> >
> > If I get the time I will attempt to search through some of the
> > 1990-2000 ISHM/IMAPs symposiums for more info
> >
> > ?Thought you were on vacation ...?
> >
> > Steve Creswick
> > Sr Associate - Balanced Enterprise Solutions
> > http://www.linkedin.com/in/stevencreswick
> >                          616 834 1883<tel:616%20834%201883>
> >
> >
> >
> > -----Original Message-----
> > From: TechNet [mailto:[log in to unmask]<mailto:[log in to unmask]>] On
> > Behalf Of Joyce Koo
> > Sent: Thursday, June 13, 2013 10:22 AM
> > To: [log in to unmask]<mailto:[log in to unmask]>
> > Subject: Re: [TN] Dropbox
> >
> > Inge, any study regarding the potential damage of memory by UV ozone?
> > Especially, programmables.  Thx.
> > --------------------------
> > Sent using BlackBerry
> >
> >
> > ----- Original Message -----
> > From: Inge Hernefjord [mailto:[log in to unmask]<mailto:
> > [log in to unmask]>]
> > Sent: Thursday, June 13, 2013 09:37 AM
> > To: [log in to unmask]<mailto:[log in to unmask]> <[log in to unmask]<mailto:
> > [log in to unmask]>>
> > Subject: [TN] Dropbox
> >
> > / Cleaning
> >
> > added
> >
> > 1. Relative Etch rate in Fluorcarbon Plasmas
> >
> > 2.UV/Ozone Cleaning of Surfaces
> >
> > 3. Very Low Temperature Ashing (VLTA)
> >
> > Old information, still actual, but hard to find. Most about cleaning
> > was done more than 20 years ago. The Cyprus guru knows. He has written
> > a good book that is permanently on my desk.
> >
> > Inge
> >
> >
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