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June 2013

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Subject:
From:
Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Joyce Koo <[log in to unmask]>
Date:
Thu, 13 Jun 2013 20:26:38 +0000
Content-Type:
text/plain
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text/plain (190 lines)
On board there are many bare dies nowadays. - I guess. 
--------------------------
Sent using BlackBerry


----- Original Message -----
From: Inge Hernefjord [mailto:[log in to unmask]]
Sent: Thursday, June 13, 2013 04:19 PM
To: [log in to unmask] <[log in to unmask]>
Subject: Re: [TN] Dropbox

Wayne, why on earth (not SPACE) did you UV clean bare chips?

Inge


On 13 June 2013 22:14, Wayne Thayer <[log in to unmask]> wrote:

> I've been "burned" by UV/Ozone cleaning of bare die which have FLASH or
> EEPROM.  When they make these, it is common for the manufacturer to put a
> device code in this space and/or store a table of "bad sectors".  Too much
> UV erased the memory, so programmers don't know how to program the parts.
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
> Sent: Thursday, June 13, 2013 2:03 PM
> To: [log in to unmask]
> Subject: Re: [TN] Dropbox
>
> Thx. Would be interested to know any CSP, flipchip, etc.
> --------------------------
> Sent using BlackBerry
>
>
> From: Inge Hernefjord [mailto:[log in to unmask]]
> Sent: Thursday, June 13, 2013 01:59 PM
> To: TechNet E-Mail Forum <[log in to unmask]>; Steven Creswick <
> [log in to unmask]>; Joyce Koo
> Subject: Re: [TN] Dropbox
>
> Hi, genious duo,
>
> I had an old US Army report that emphasizes a lot about irradiation of
> semiconductors. Now, you have to make a distinction between cleaning
> semiconductors and expose them to natural irradiation as ready  products.
>  UV/O2 is a outstanding method of cleaning any substrates, inclusive
> semiconductor wafers of all kinds, because you get a cleanliness on
> molecular level. And under controlled processes, the method does not cause
> any harm to the target.
>
> About semi packages and irradiation, I understand what Juice aim at,
> namely a exposure to high energy partikels or photons or phonons at such a
> intensity level that you exceed the band gap levels ,  equal to a memory
> I/O status shift.  I believe modern packages and semis are radiation
> hardened for critical applications like for SPACE and others. If you, of
> some reason, want to clean assembled boards by means of UV/Ozone, nothing
> will happen.
>
> You can take part of the report under 'Cleaning' and the title is
>  'UV-Ozone Cleaning of Semiconductor Surfaces'.
>
> Steve, you are welcome to add your antique papers to Dropbox. As I said,
> most was evaluated decades ago.
>
> Inge
>
>
> On 13 June 2013 17:28, Steven Creswick <[log in to unmask]<mailto:
> [log in to unmask]>> wrote:
> Joyce,
>
> I am going to send a couple old papers on plasma cleaning to Inge to see
> if he will incorporate them into his drop box.  They are both 1989 vintage,
> essentially back in the olden days of plasma cleaning, so may be of little
> specific use, other than generics.
>
> If I get the time I will attempt to search through some of the 1990-2000
> ISHM/IMAPs symposiums for more info
>
> ?Thought you were on vacation ...?
>
> Steve Creswick
> Sr Associate - Balanced Enterprise Solutions
> http://www.linkedin.com/in/stevencreswick
>                          616 834 1883<tel:616%20834%201883>
>
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]<mailto:[log in to unmask]>] On Behalf
> Of Joyce Koo
> Sent: Thursday, June 13, 2013 10:22 AM
> To: [log in to unmask]<mailto:[log in to unmask]>
> Subject: Re: [TN] Dropbox
>
> Inge, any study regarding the potential damage of memory by UV ozone?
> Especially, programmables.  Thx.
> --------------------------
> Sent using BlackBerry
>
>
> ----- Original Message -----
> From: Inge Hernefjord [mailto:[log in to unmask]<mailto:
> [log in to unmask]>]
> Sent: Thursday, June 13, 2013 09:37 AM
> To: [log in to unmask]<mailto:[log in to unmask]> <[log in to unmask]<mailto:
> [log in to unmask]>>
> Subject: [TN] Dropbox
>
> / Cleaning
>
> added
>
> 1. Relative Etch rate in Fluorcarbon Plasmas
>
> 2.UV/Ozone Cleaning of Surfaces
>
> 3. Very Low Temperature Ashing (VLTA)
>
> Old information, still actual, but hard to find. Most about cleaning was
> done more than 20 years ago. The Cyprus guru knows. He has written a good
> book that is permanently on my desk.
>
> Inge
>
>
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