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May 2013

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Subject:
From:
"lduso - Diamond-MT.com" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, lduso - Diamond-MT.com
Date:
Thu, 9 May 2013 08:57:43 -0400
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You need a "definitely coating free area", a "definitely coated area",
and in between them an internationally recognized DMZ, an area that can or
cannot have coating. That area should be large enough to allow the
inevitable "creep" of the liquid being sprayed. With automation you are not
dealing with a straight, sharp separation line like masking provides.

With that in mind, on the design, components that with out a doubt need to
be coated, should not be placed adjacent to components that can not be
coated. Respect the DMZ!

Another question is the type of automation. If you want a 100% coating, and
a extremely fast process time, then automated dipping is the way to go. The
board just has to be designed properly; as many connectors, switches, etc.
as possible along a side edge so when dipped, no masking is required. Or if
masking is being done, something that can be masked with a liquid mask for
sealing.

Lloyd Duso
Diamond-MT
Plant Manager
(814) 535-3505
www.Diamond-mt.com


On Thu, May 9, 2013 at 8:40 AM, Douglas Pauls
<[log in to unmask]>wrote:

> Good morning all,
>
> Another conformal coating related question.  What, from an assembly point
> of view, would you tell a board designer are good design practices to make
> an assembly coatable from an automated standpoint.
>
> I think we would all agree that having an assembly with no keep out zones
> and a constant height for components to be the ideal.  The more holes we
> poke in the film and the farther we get from the ideal, the less we can
> automate coating.
>
> So, what would you tell a designer to do?
>
> Or, to put the shoe on the other hand, what kinds of things should they
> NOT do, or bad practices to avoid?
>
> And, yes, I know It Depends.
>
> Doug Pauls
>
>
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