TECHNET Archives

May 2013

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Joe Macko <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Tue, 7 May 2013 12:03:17 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (44 lines)
Technetters,

 

A while back I remember seeing within I think an IPC document an
approach for categorizing circuit boards in terms of component density,
complexity, size, etc. so one board could be effectively compared
against another board(s) as a means to judge say SMT processing
differences.  I thought that it was within J-STD-001 but did not see it.

 

Would someone pls help and let me know what IPC doc has such
information.   Thx

 

Regards,

-Joe 

 

 

Regards,

-Joe M.

x3049

 

 


"This e-mail and any attachments are solely for the use of the addressee and may contain L-3 proprietary information that may also be defined as U.S. Government export controlled technical data. If you are an unintended recipient of this e-mail, use, disclosure or distribution of its content is prohibited. Please notify the sender by return e-mail and immediately delete this message."
 

______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

ATOM RSS1 RSS2