Here is my engineering answer: if your Hi Rel Agencies ask for dip, and possibly due to legacy program with prior track record on delam reliability assessment, you might as well stay with the dip (I think it is 350C few seconds if memory serve me right). If you using different materials - for example, leadfree laminate compare to polyimide board, you might see failure. PM or design might have to address that... My 1.91 cents.
Joyce Koo
Researcher
Materials Interconnect Lab
Office: (519) 888-7465 79945
BlackBerry: (226) 220-4760
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of SARAVANAN R
Sent: Monday, May 27, 2013 8:22 AM
To: [log in to unmask]
Subject: Re: [TN] Difference berween solder float and solder dip
Dear Mr Wayne Thayer,
Some hi reliability agencies asking for solder dip to test the robustness of the PTH and laminate integrity.
But all the standards talk about solder float & reflow simulation.
I am interested in knowing which is the robust test ?. What are the difference in stress that the specimen is undergoing the two tests?. regards,
R.Saravanan
________________________________
From: Wayne Thayer <[log in to unmask]>
To: [log in to unmask]
Sent: Sunday, 26 May 2013 11:27 PM
Subject: Re: [TN] Difference berween solder float and solder dip
Hi Inge-
I'm confused! Is it possible you messed up 1&2? Testing wettability on components makes sense to me.
I thought float was for seeing how robust the circuit board construction is, although the "popcorn" test was done on components years ago before people knew how dry components needed to be kept.
Wayne
________________________________________
From: TechNet [[log in to unmask]] on behalf of Inge Hernefjord [[log in to unmask]]
Sent: Sunday, May 26, 2013 7:26 AM
To: [log in to unmask]
Subject: Re: [TN] Difference berween solder float and solder dip
Hi Ramakrishnan,
1. Solder dip test tells about the WETTABILITY.
2. Floating test tells about the ALIGNMENT
Typically 1. is performed on just a few coupons and NO components, while 2.
is done with many coupons (or PCBs) and WITH components. For getting good
statistics it's not unusual with 10,000 components.
Inge
On 25 May 2013 14:02, Ramakrishnan Saravanan <[log in to unmask]> wrote:
> What is the difference between solder dip test and solder float test of
> PWB test coupon. What is the difference in stress levels ?
>
> regards,
>
> R.Saravanan
>
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