Dear Mr Wayne Thayer,

Some hi reliability agencies asking for solder dip to test the robustness of the PTH and laminate integrity. 

But all the standards talk about solder float & reflow simulation. 


I am interested in knowing which is  the robust test ?. What are the difference in stress that the specimen is undergoing the two tests?. regards,

R.Saravanan



________________________________
 From: Wayne Thayer <[log in to unmask]>
To: [log in to unmask] 
Sent: Sunday, 26 May 2013 11:27 PM
Subject: Re: [TN] Difference berween solder float and solder dip
 

Hi Inge-

I'm confused!  Is it possible you messed up 1&2?  Testing wettability on components makes sense to me.

I thought float was for seeing how robust the circuit board construction is, although the "popcorn" test was done on components years ago before people knew how dry components needed to be kept.

Wayne
________________________________________
From: TechNet [[log in to unmask]] on behalf of Inge Hernefjord [[log in to unmask]]
Sent: Sunday, May 26, 2013 7:26 AM
To: [log in to unmask]
Subject: Re: [TN] Difference berween solder float and solder dip

Hi Ramakrishnan,

1. Solder dip test tells about  the WETTABILITY.

2. Floating test tells about the ALIGNMENT

Typically 1. is performed on just a few coupons and NO components, while 2.
is done with many coupons (or PCBs) and WITH  components. For getting good
statistics it's not unusual with 10,000 components.

Inge


On 25 May 2013 14:02, Ramakrishnan Saravanan <[log in to unmask]> wrote:

> What is the difference between solder dip test and solder float test of
> PWB test coupon. What is the difference in stress levels ?
>
> regards,
>
> R.Saravanan
>


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