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Date: | Sun, 26 May 2013 17:57:51 +0000 |
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Hi Inge-
I'm confused! Is it possible you messed up 1&2? Testing wettability on components makes sense to me.
I thought float was for seeing how robust the circuit board construction is, although the "popcorn" test was done on components years ago before people knew how dry components needed to be kept.
Wayne
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From: TechNet [[log in to unmask]] on behalf of Inge Hernefjord [[log in to unmask]]
Sent: Sunday, May 26, 2013 7:26 AM
To: [log in to unmask]
Subject: Re: [TN] Difference berween solder float and solder dip
Hi Ramakrishnan,
1. Solder dip test tells about the WETTABILITY.
2. Floating test tells about the ALIGNMENT
Typically 1. is performed on just a few coupons and NO components, while 2.
is done with many coupons (or PCBs) and WITH components. For getting good
statistics it's not unusual with 10,000 components.
Inge
On 25 May 2013 14:02, Ramakrishnan Saravanan <[log in to unmask]> wrote:
> What is the difference between solder dip test and solder float test of
> PWB test coupon. What is the difference in stress levels ?
>
> regards,
>
> R.Saravanan
>
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